Unlock instant, AI-driven research and patent intelligence for your innovation.

Apparatus, system and manufacture method with bottom heat spreader

A technology of equipment and heat sink, applied in the field of microelectronic devices, can solve the problem of insufficient heat dissipation scheme

Inactive Publication Date: 2009-10-14
INTEL CORP
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this design, current cooling solutions will likely prove inadequate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus, system and manufacture method with bottom heat spreader
  • Apparatus, system and manufacture method with bottom heat spreader
  • Apparatus, system and manufacture method with bottom heat spreader

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0010] The first embodiment of the present invention includes an apparatus including: a substrate including a first plurality of through holes and a second plurality of through holes, the first plurality of through holes being used to provide the substrate and a printed circuit All electrical connections between the boards, and the second plurality of through holes are used to provide additional thermal connections to the printed circuit board; use wire bonding to electrically connect to the chip of the substrate; and The heat sink between the substrate and the chip, wherein the heat sink is disposed above the first plurality of through holes and the second plurality of through holes, and wherein the heat sink has a thermal expansion coefficient equal to The thermal expansion coefficient of the chip is composed of heat sinks.

[0011] The first embodiment may further include: a second chip stacked on the chip and electrically connected to at least one of the chip and the substrate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Embodiments of the present invention provide a microelectronic device having a heat sink disposed between a chip and a substrate to which the chip is electrically connected. For one embodiment of the invention, the heat sink is a heat sink with a coefficient of thermal expansion approximately equal to that of the chip.

Description

Technical field [0001] The embodiments of the present invention generally relate to the field of microelectronic devices, and more particularly to methods and apparatuses for removing heat from such devices. Background technique [0002] The heat dissipation of wire-bonded microelectronic devices generally uses a heat sink arranged on a silicon die (chip). figure 1 A wire bonding device according to the prior art is shown. figure 1 The device 100 shown includes a chip 105 that is wire bonded to a substrate 110 using bonding wires 106. The chip 105 may be silicon or some other semiconductor material. During operation, heat is generated, which must be removed from the chip. The substrate 110 may generally be made of ceramic or some type of organic package. The substrate 110 is disposed on a printed circuit board (PCB) (mother board) not shown. [0003] The heat is removed by the heat sink 115, which is usually a metal with high thermal conductivity, such as copper or aluminum. Ge...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/433H01L23/367H01L25/065H01L23/34
CPCH01L23/4334H01L2225/06589H01L2924/15311H01L2224/32145H01L23/367H01L25/0657H01L2924/01078H01L2924/10253H01L2224/48145H01L24/48H01L2224/48091H01L2224/48227H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207H01L23/36H01L23/433
Inventor 戴尔·哈科特罗伯特·尼克森布赖恩·塔格特
Owner INTEL CORP