Making method of pliable active component array base board
A technology of active components and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problem that the flexible substrate is not easy to remove, so as to improve the process qualification rate and component characteristics, and avoid the accumulation of charges Effect
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[0037] The first embodiment
[0038] 1A to 1C are the manufacturing process of the flexible active device array substrate according to the first embodiment of the present invention. First, referring to FIG. 1A, the flexible substrate 120 is adhered to the rigid substrate 130 by the adhesive layer 110 to form a substrate module 100. The adhesion layer 110 includes a colloid 112 and sacrificial particles 114 doped in the colloid 112. In this embodiment, the sacrificial particles 114 include oxide particles, amorphous silicon particles, or a combination of the foregoing, and the particle size of the sacrificial particles 114 is, for example, 0.01 μm to 10 μm. In addition, the flexible substrate 120 is, for example, a plastic substrate, and the rigid substrate 130 is, for example, a glass substrate.
[0039] Next, referring to FIG. 1B, an active device array process is performed on the flexible substrate 120 adhered to the rigid substrate 130. Among them, the active device array pro...
Example
[0042] Second embodiment
[0043]2A to 2C show the manufacturing process of the flexible active device array substrate according to the second embodiment of the present invention. The manufacturing process of the flexible active device array substrate of this embodiment is similar to that described in the first embodiment. According to the process shown in FIGS. 2A to 2C, the flexible substrate 220 is adhered to the rigid substrate 230 by the adhesive layer 210 to form the substrate module 200, and then the flexible substrate 220 is adhered to the rigid substrate 230. Carry out active component array technology. Then, the adhesive layer 210 is irradiated with a light source, and the flexible substrate 220 and the hard substrate 230 are separated.
[0044] The difference between the two is that the adhesive layer 210 in this embodiment includes a colloid 212 and a sacrificial pattern layer 214 (as shown in FIG. 2A). The material of the sacrificial pattern layer 214 is, for exampl...
Example
[0048] The third embodiment
[0049] 3A to 3C illustrate the manufacturing process of the flexible active device array substrate according to the third embodiment of the present invention. The manufacturing process of the flexible active device array substrate of this embodiment is substantially the same as that described in the first and second embodiments. The difference is that the adhesive layer 310 in this embodiment includes a colloid 312 and conductive particles 314 doped in the colloid 312 (as shown in FIG. 3A). The conductive particles 314 include oxide particles, amorphous silicon particles, or metal particles. Among them, the material of the metal particles is, for example, gold, silver, copper, titanium oxide, or a combination of the above. In addition, the particle size of the conductive particles 314 is, for example, 0.01 μm to 10 μm.
[0050] In the substrate module 300, the conductive particles 314 are similar to the sacrificial pattern layer 214 of the second emb...
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