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LED encapsulation structure and its making method

A technology of LED packaging and LED chips, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of energy waste and output efficiency reduction, achieve high light output efficiency, easy control of heat dissipation, and reduce light energy loss.

Inactive Publication Date: 2007-08-01
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the actual output efficiency of the LED device will be reduce

Method used

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  • LED encapsulation structure and its making method
  • LED encapsulation structure and its making method
  • LED encapsulation structure and its making method

Examples

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Example Embodiment

[0036] The packaging structure of the present invention uses the conductive support body material to directly form the external pin part and the reflective wall in the chip placement area, the manufacturing process is simple and convenient, and no additional special process equipment is required. The manufactured package structure has the effect of reducing energy loss and improving light output efficiency. The following will clearly illustrate the spirit of the present invention with the accompanying drawings and detailed description. For those skilled in the art, after understanding the preferred embodiments of the present invention, they can change and modify the technology disclosed in the present invention without departing from it. The spirit and scope of the present invention.

[0037] 2A, which is a perspective view of a preferred embodiment of the LED packaging structure of the present invention. The LED package structure includes a package base 202 inside which has a chi...

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Abstract

A LED encapsulation structure includes an encapsulation base, a conducting rack and a reflecting wall. The inner of the encapsulation base possesses a chip placing area which is used to place a LED chip; part of the conducting rack is exposed to the chip placing area. The reflecting wall is connected with the conducting rack, and a side wall is bent and extent from the conducting rack and covers the chip placing area, so a reflecting approach is provided.

Description

technical field [0001] The present invention relates to a packaging structure and a manufacturing method thereof, in particular to an LED packaging structure and a manufacturing method thereof. Background technique [0002] Light emitting diodes (light emitting diodes; LEDs) have the characteristics of long life, power saving, safety, and fast response. With the advancement of technology, LEDs can display higher and higher brightness levels, and their application fields are quite extensive. LEDs in the prior art are produced by metal conductive brackets combined with plastic plastic molding, as shown in FIG. 1 , a cross-sectional view of a lead frame LED structure in the prior art. [0003] The two conductive brackets 104 and 106 are respectively connected to the positive and negative electrodes of the LED chip 102 . In the existing manufacturing technology, the encapsulation material is covered and fixed to the conductive support by plastic molding to form a base 108 , and...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/60
CPCH01L33/486H01L33/60H01L2224/48091H01L2224/48247
Inventor 叶寅夫庄世任
Owner EVERLIGHT ELECTRONICS