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Inverted trapezoidal LED support and LED light source thereof

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of chip light waste and other problems, and achieve the effects of easy light output angle, reduction of light energy loss, and control of light output angle

Inactive Publication Date: 2013-09-11
HENAN SENYUAN ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the light emitted by the chip is not 100% utilized, mainly because the light on the side of the chip is wasted

Method used

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  • Inverted trapezoidal LED support and LED light source thereof
  • Inverted trapezoidal LED support and LED light source thereof

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Experimental program
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Embodiment Construction

[0011] Such as figure 1 As shown: the present invention refracts the side light emitted by the illuminant through the inverted trapezoidal reflective wall, so that the side light can be fully utilized.

[0012] exist figure 2 Middle: 1. Inverted trapezoidal reflective wall 2. Gold wire; 3. LED chip; 4. Silicone lens; 5. Package base; 6. Conductive bracket;

[0013] The base (6) of the bracket of the present invention is connected to the reflective wall (1), the LED chip (3) is in the protruding part of the center of the bracket (6), the package base (5) is filled and protected by silica gel (4), and the reflective wall (1) The included angle (7) with the horizontal plane is 40°; the entire LED bracket is made of metal material or metal-ceramic composite material.

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Abstract

The invention discloses an inverted trapezoidal LED support and an LED light source of the inverted trapezoidal LED support, and relates to the technical field of LEDs, so that the lighting effect is improved, and loss is reduced. The LED support mainly comprises an electric conduction support, a packaging substrate and an inverted trapezoidal reflecting barrier, wherein an area used for placement of chips is formed on the packaging substrate and at the center position of the electric conduction support, the area is mainly used for placement of the LED chips, and the reflecting barrier is in an inverted trapezoidal shape, is connected with the electric conduction support and can be used for providing a reflecting path.

Description

Technical field [0001] The invention relates to the technical field of light-emitting diodes (LEDs), in particular to a novel LED package. Background technique [0002] A light emitting diode (LED) is a semiconductor device that is excited to generate light of various colors in response to an electric current. The color of light produced by an LED is primarily determined by the chemical composition of the LED semiconductor. This LED has several advantages over conventional light-emitting devices using filaments, such as longer life, lower driving voltage, better initial excitation characteristics, higher resistance to vibration, and higher resistance to repeated power supplies Switchability. Therefore, the demand for such LEDs is gradually increasing. [0003] In recent years, large-sized liquid crystal displays (LCDs) have developed rapidly, and LEDs are used in both light emitting devices and backlight devices thereof. But the light emitted by the chip is not 100% util...

Claims

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Application Information

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IPC IPC(8): H01L33/60
CPCH01L2224/8592H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 李帅谋夏中华朱志祥聂新跃张海波
Owner HENAN SENYUAN ELECTRIC CO LTD