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Method for combining closely heat pipe and heat radiation fin and application apparatus thereof

A technology of heat dissipation fins and heat pipes, which is applied in heat exchange equipment, other manufacturing equipment/tools, cooling/ventilation/heating transformation, etc., and can solve the problems of reduced heat conduction efficiency, affecting bonding and heat transfer efficiency, and high defective rate, etc. question

Inactive Publication Date: 2007-09-19
陈世明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although this method has no harm to the human body and the environment from the above-mentioned chemical substances, the plastic melting caused by the friction of different metals still has the problem of the uniformity of the plastic melting part, and it is easy to form gaps that affect the bonding and heat transfer efficiency.
[0008] In addition, in other practical manufacturing methods for heat pipes and heat dissipation fins, the industry adopts the method of piercing and pressing, mainly using stamping fixtures and automatic tools, and the through holes on the end faces of the heat dissipation fins correspond to the heat dissipation process piece by piece during the pressing process. The outer diameter of the conduit produces a tight bond; however, the above press-pressing production method, in addition to the time-consuming production of one-by-one pressing, what's more, each cooling fin is subjected to punching vibration of the machine and the through-hole production during the pressing process. Tolerance will affect the alignment and tightening effect of heat dissipation fins and heat pipes, and it is easy to produce unbonded gaps in different positions, resulting in high defective rate, poor heat transfer efficiency and heat dissipation effect, etc.
[0009] As for the current industry, another method of combining stamping automatic equipment and stamping fixtures is to put heat pipes through multiple pitches and combine them with heat dissipation fins. The sharp plate-shaped molded parts cooperate with the stamping process of the stamping tool. The long tapered end of the molded part exerts force to cause the heat pipe to deform in a long area and tighten the heat dissipation fins. However, the heat pipe and the heat dissipation fins are tightly connected. The tight connection and thermal conduction of the fins are only sufficient on the joint surfaces of the fins. However, the above-mentioned conventional manufacturing method, which is stamped by the end of the elongated tapered tip, will make the heat pipe produce a long and large heat pipe. The deformation of the area leads to the reduction of the inner diameter of the entire heat pipe, the decrease of the fluid flow rate and the increase of the flow resistance, which reduces the heat conduction efficiency, and generally cannot achieve good uniformity due to the applied force, so that only the joint surface still has gaps and fails to achieve Good bonding and heat transfer, and if a large stamping force is applied without good bonding, it may cause the heat pipe to break, and the defect rate is high

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  • Method for combining closely heat pipe and heat radiation fin and application apparatus thereof
  • Method for combining closely heat pipe and heat radiation fin and application apparatus thereof
  • Method for combining closely heat pipe and heat radiation fin and application apparatus thereof

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Embodiment Construction

[0043] The technical content and detailed description of the present invention are now described as follows in conjunction with the accompanying drawings:

[0044] Please refer to Figures 1 to 5, which are schematic diagrams of the manufacturing process and combination structure of an embodiment of the urgent combination method of the heat pipe and the heat dissipation fin and the application device of the present invention, as shown in the figure: the application fixture device of the present invention is The method for urgently combining heat pipes and cooling fins, the steps of which at least include:

[0045] Step 1: Provide a plurality of heat dissipation fins 1, form at least one through hole 11 and a through groove 12 connected to the through hole 11 on the surface, and provide fasteners 13 on both sides of the heat dissipation fins 1;

[0046] Step 2: Fasten the plurality of cooling fins 1 with fasteners 13 to form fin groups 2 arranged at intervals;

[0047] Step 3: ...

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Abstract

A tight combination method of thermal conduction pipes and thermal cooling fins and its application installations include: providing a device having a multi-punch mode formed by intervally arranging of a majority of punch pieces, which respectively applies the tight combination to the default position, in order to meet with a tight stamping process to tightly connect the thermal conduction pipes and the thermal cooling fins; the method uses a fastener to fasten a majority of the thermal cooling fins to form a fins group arranged with a spacing; thermal conduction pipes are drilled through each thermal cooling fin; then a tight integration process, uses a said device, namely a majority of stamping parts, matched with a stamping technology and a the pressure selecting control, to apply a stamping force to the corresponding pre-set tight position of each thermal conduction pipe and thermal cooling fin, thereby forming an integration tight combined one by the deformation of each default tight connecting position; the combination of the thermal conduction pipes and the thermal cooling fins is completed as a cooling device.

Description

technical field [0001] The urgent combination method of the heat pipe and the heat dissipation fin and its application device of the present invention especially refers to a device with multiple punches that is manufactured and applied by one stamping to form a preset that only corresponds to the heat pipe and the heat dissipation fin Tight joint position, combined with the selected stamping force to form a plurality of non-continuous single-point positions tightly combined with heat pipes and heat dissipation fins. The molding method has the advantages of improving area-type tight joints, poor thermal conductivity, poor bonding and high defect rate, etc. question. Background technique [0002] It is known that the heat dissipation devices currently used in electronic components, especially the heat dissipation devices that require better heat dissipation efficiency, are all heat dissipation devices composed of heat pipes and heat dissipation fins, so as to quickly transfer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B23P23/00B21D53/02
Inventor 陈世明
Owner 陈世明