Element mounting device, method and system

Abstract

The invention relates to a component mounting method. The common mark on a basal plate is took a view using a first and a second basal plate camera (23A,23B) mounted on head unit (5A,5B), in order to obtain the coordinate changing data between the two head units (5A,5B). At least the common mark to perform mounting by the two head units (5A,5B) among the marks of the basal plate (P) using a firstcamera (23A) is took a view and discriminated. A part of the correction data responsible by a first head unit (5A) in the mounted part of the basal plate (P)based on the mark actual measurement position data, and the correction data responsible by a second head unit (5B) based on the mark actual measurement position data and the coordinate changing data. The components are mounted by driving twohead units (5A,5B). Each mounted basal plate is mounted by performing the above steps. The said invention can effectively perform component mounting and treatment and ensure higher mounting accuracy.

Description

technical field [0001] The present invention relates to a component mounting method using a component mounting device that takes out components from a component supply unit by a component mounting head unit and mounts them on a substrate such as a printed circuit board, and the device. Background technique [0002] In a conventionally known component mounting apparatus, chip components such as ICs and transistors are picked up from a component supply unit by a movable component mounting head unit and mounted on a printed circuit board. In this component mounting device, in order to ensure the mounting accuracy with respect to the board, a camera (camera) that moves integrally with the head unit is provided, and the mark on the board is recognized by the camera to confirm the relative position between the head unit and the board. Positional relationship (positional deviation of mounted parts on the substrate). [0003] In addition, it is generally believed that in this type ...

AI Technical Summary

Problems solved by technology

[0006] That is, when the above-mentioned double-head type component mounting device is targeted at a substrate containing a plurality of marks such as a multi-connected substrate, it is necessary to perform mark recognition and marking on the substrate for the purpose of detecting the movement error of the head unit for each head unit. There is recognition of multiple marks, therefore, the mark recognition processing time increases during the mounting process of one board

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