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Method for combining two objects using two camera positioning

A camera and object technology, applied in the field of combining two objects using dual camera positioning, can solve problems such as inapplicability

Inactive Publication Date: 2007-12-05
CONTREL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the substrate / circuit board is installed without an edge that can be used to rest on the reference surface, the above method is not applicable

Method used

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  • Method for combining two objects using two camera positioning
  • Method for combining two objects using two camera positioning
  • Method for combining two objects using two camera positioning

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Embodiment Construction

[0024] In order to describe in detail the technical characteristics of the present invention, the following preferred embodiment and accompanying drawings are described as follows:

[0025] As shown in Figures 1 to 5, a method for combining two objects using dual camera positioning provided by the first preferred embodiment of the present invention mainly has the following steps:

[0026] A. Prepare two cameras 11, a display device 13, and two objects 15, 17 to be combined: wherein, the first object 15 is an IC (Integrated Circuit) in this embodiment, and there are two second objects separated by a predetermined distance D on it. A positioning mark 16, the second object 17 is a glass substrate in this embodiment, there are two second positioning marks 18 separated by a predetermined distance D on it, and the imaging areas of the two cameras 11 are roughly separated by a predetermined distance D, so that Align the two positioning marks 16 , 18 on the two objects 15 , 17 to take...

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PUM

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Abstract

The present invention is a method relating to use the double video camera location to combine two objects, including the following steps: A. preparing two video cameras, a display device and the two object for combination; B. acquiring image of the two first location marks on the first object; C. acquiring image of the two second location marks on the second object; D. acquiring the displacement between the two objects; E. moving one of the objects with the said displacement; F. combining; as the said steps, the location and aligned combination can be achieved by image processing.

Description

technical field [0001] The present invention is related to the positioning method when two objects are combined, especially a method for combining two objects by using dual camera positioning. Background technique [0002] According to, in the known technology, for the combination of two objects, the procedure of combination usually needs to be aligned and positioned by the operator before combination. Furthermore, when IC (integrated circuit) is combined with circuit board or substrate, the substrate and IC must be aligned before they can be combined. If they are not aligned, there will be wrong connection of IC pins and the The problem of misoperation or even short circuit occurs. [0003] In the known alignment and positioning technology, most of the edges of the circuit board or substrate are placed against a reference plane, and then the robot arm with a calibrated position is used to grab the IC and place it on the circuit board / substrate, so as to This allows accura...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/08H05K13/04H01L21/68
Inventor 李炳寰张勋章黄哲忠李美雅
Owner CONTREL TECH CO LTD