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Heat conducting base and temperature-homogenizing plate possessing same

A technology of heat conduction and uniform temperature, which is applied in the direction of heat exchange equipment, heat exchanger shell, indirect heat exchanger, etc. It can solve the problems of uneven surface, permanent deformation, uneven width and outer edge, etc.

Inactive Publication Date: 2010-11-03
JIEFEI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as we all know, when the general metal material is plastically deformed by external force, it must use stress to make the material plastic flow and cause permanent deformation.
However, in the prior art, a solid heat-conducting base is used to directly extrude. In theory, the external force applied must be quite large, and it may be difficult in actual manufacturing.
At the same time, since the prior art does not provide guidance for plastic deformation, plastic flow lines are formed on the pressing surface, that is, the surface is not smooth, and the extrusion and deformation of the heat pipe are also unstable, and the width of the heat conduction base will also become wider, while the width The problem that the outer edge is not even
Therefore, under such conditions, the deformation of each heat pipe will be uneven, making it difficult to control the quality of the finished product.

Method used

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  • Heat conducting base and temperature-homogenizing plate possessing same
  • Heat conducting base and temperature-homogenizing plate possessing same
  • Heat conducting base and temperature-homogenizing plate possessing same

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Embodiment Construction

[0024] In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the attached drawings are only for reference and illustration, and are not intended to limit the present invention.

[0025] figure 1 and Figure 5 Shown are the three-dimensional exploded view of the heat conduction base and the heat pipe and the three-dimensional schematic diagram of the vapor chamber of the present invention, respectively. The present invention provides a heat conduction base and a vapor chamber with the heat conduction base. The heat conduction base 3 is assembled and extruded from the heat conduction base 1 and a plurality of heat pipes 2. The heat conduction base 1 It may be extruded, such as an extruded aluminum base. The heat conduction base 1 has a first plate body 11 and a second plate body 12, the first and second plate bodies 11, 12 are p...

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Abstract

The invention relates to a heat-conducting pedestal and a temperature equalization plate with the heat-conducting pedestal. The temperature equalization plate is prepared by assembling extruding a heat-conducting pedestal and a plurality of heat pipes. The heat-conducting pedestal comprises a first plate, wherein a plurality of hollow ribs are provided on the first plate and extending from one tangent edge of the first plate to another tangent edge of the first plate, the follow ribs are spacedly arranged with each other, a hollow space is formed between any two adjacent hollow ribs, and a deep hope extending along the length direction of the hollow rib is arranged in each hollow rib and used for allowing each heat pipe to respectively pass through each deep hole and be accommodated in each hollow rib.

Description

technical field [0001] The invention relates to a heat conduction base and a heat chamber with the heat conduction base, in particular to a heat conduction base for combining with a heat pipe, and a heat conduction base and a heat chamber that are squeezed so that the heat conduction base and the heat pipe are more tightly combined. warm plate. Background technique [0002] The combination technology of the heat pipe and the heat conduction base has been disclosed in the prior art. A solid heat conduction base is provided with a hole corresponding to the heat conduction pipe, and after the heat conduction pipe is implanted in the hole, the heat conduction The base exerts an external force to deform together with the heat conduction tube, so that the heat conduction tube can be tightly combined in the hole of the heat conduction base. [0003] However, it is well known that when a general metal material undergoes plastic deformation due to external pressure, stress must be u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02F28F9/007
Inventor 徐惠群
Owner JIEFEI