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Method for manufacturing multi-layer wiring substrate

A technology of multilayer wiring substrate and manufacturing method, which is applied in the direction of multilayer circuit manufacturing, electrical components, electric solid devices, etc., can solve the problems of inability to achieve fine wiring patterns, difficult to accurately align lower layer wiring patterns, etc., and achieve fine The effect of softening and preventing warping

Active Publication Date: 2011-05-11
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, when configuring the exposure mask, it is difficult to accurately align the wiring pattern of the underlying layer, so that the refinement of the wiring pattern cannot be achieved.

Method used

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  • Method for manufacturing multi-layer wiring substrate
  • Method for manufacturing multi-layer wiring substrate
  • Method for manufacturing multi-layer wiring substrate

Examples

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Embodiment Construction

[0045] An embodiment of a multilayer wiring board embodying the present invention will be described in detail below with reference to the drawings. figure 1 2 is a schematic plan view of the multilayer wiring board, and FIG. 2 is a cross-sectional view of the multilayer wiring board.

[0046] Such as figure 1 As shown, the multilayer wiring board 11 is rectangular in plan view, and has a plurality (here, 4×4) of product regions 100 and a frame region 101 surrounding these product regions 100 . Since there is no frame region 101 in the product, it can be cut and removed in the mold opening process at last.

[0047] As shown in FIG. 2, the core substrate 12 constituting the multilayer wiring substrate 11 is a substantially rectangular plate-shaped member (thickness: 0.8 mm) made of glass epoxy resin, and has an upper surface 13 and a lower surface 14 as main surfaces. . First buildup layer 15 (buildup wiring layer) is formed on upper surface 13 of core substrate 12 , and se...

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PUM

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Abstract

The invention provides a manufacturing method for a multilayer wiring substrate, which can symmetrically transfer heat to a plurality of chip part substrates in an annealing procedure to reduce shrink deviation of the substrates. The multilayer wiring substrate comprises the chip part substrates and the laminated layers arranged on an upper surface and a lower surface of the chip part substrate. In the manufacturing method for such a multilayer wiring substrate, a plurality of double-face copper clad laminate plates (48) are prepared in the preparation procedure; the double-face copper clad laminate plates (48) are formed by bonding metal foil on a main surface comprising an insulating substrate composed by resin material. In the annealing procedure, a receiving net rack (50) is adopted within a hot wind drying device (51) to arrange the plurality of double-face copper clad laminate plates (48) in a manner of longitudinal disposal in a case of presence of a gap, thus heating each double-face copper clad laminate plate (48).

Description

technical field [0001] The present invention relates to a method of manufacturing a multilayer wiring board, and more particularly to an annealing step of a substrate material. Background technique [0002] In recent years, along with the miniaturization of electric equipment, electronic equipment, etc., there has been an increasing demand for miniaturization and high density of wiring boards and the like mounted on these equipment. In order to meet such market needs, multilayer technology of wiring substrates has been studied. As a method for multilayering a wiring board, a build-up method is generally used. The build-up method means that resin insulating layers and conductive layers are alternately laminated on the front and back surfaces of a core substrate to form an integral body. [0003] When manufacturing such a multilayer wiring board, a copper-clad laminate having a structure in which copper foil is pasted on both sides of a resin substrate is generally used as a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH01L2924/0002
Inventor 渡边悟
Owner NGK SPARK PLUG CO LTD