Portable electronic device and its production method
A technology of electronic device and manufacturing method, which is applied in the direction of electrical equipment casing/cabinet/drawer, electrical components, manufacturing tools, etc., can solve the problems of complicated and time-consuming process, warping, deformation, etc., and achieves obvious conduit cross-section and moderate edge angle. , the effect of improving usability
Inactive Publication Date: 2008-09-24
ASUSTEK COMPUTER INC
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Problems solved by technology
[0003] However, it is difficult to implement the skin-mounting technology when it encounters an uneven surface, and after a period of use, the skin-mounted component will often warp or deform due to the aging of the skin, which will cause it to be incompatible with other materials. The problem of tight coupling of components
What's more, this kind of veneering method can't show the real craft beauty of wood and the warm touch that is different from the cold metal
[0004] In addition, the disadvantages of using solid wood materials as component shells include environmental protection issues (a large number of trees need to be cut down for mass production), and most solid wood materials need to be processed to soften the wood, and most of them are molded. Matching solid wood to the shape of the components is a tedious and time-consuming process, so there is an urgent need to use another material and method to solve related needs
Method used
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[0018] The manufacturing method of the casing of the portable electronic device of the present invention will be described in detail below. The portable electronic device in this example is a notebook computer. As shown in FIGS. 1A-1B , a general notebook computer 100 has an outer shell 101 , a display unit 102 , and a body 103 . The outer casing 101 has a support (please refer to the details below), and the body 103 has an input unit (such as a keyboard as shown). Moreover, the supporting member is located between the outer casing 101 and the display unit 102 , and the display unit 102 is electrically connected to the main body 103 . In this example, the method of making the outer casing 101 of the notebook computer 100 using bamboo laminated wood as an example is illustrated.
[0019] Firstly, a bamboo wood laminate is provided, which is the material of the outer shell 101 of the notebook computer 100 . Such as Figure 2A As shown, the bamboo wood laminate 400 includes a f...
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Abstract
The invention provides a manufacturing method for a portable electronic device shell, which comprises the following steps: (a) an external perine, a first surface wood and a second surface wood are provided and a groove is formed on the second surface; (b) a bracing piece is attached in the groove; and (c) the first surface and the external perine are cut to a certain thickness; wherein, a part of the first surface and the external perine presents different wood texture. The invention also provides a portable electronic device with the shell which is obtained according to the preparation method.
Description
technical field [0001] The present invention relates to a manufacturing method of a portable electronic device casing and the portable electronic device thereof, in particular to a manufacturing method of a portable electronic device casing capable of presenting a cross-section of a bamboo-wood conduit and its portable electronic device. Portable Electronic Devices. Background technique [0002] In the known technology, in order to form a wood texture on the appearance of a component, a thin sheet with wood grain is usually used to cover the outside of the component in a skinned manner, so as to achieve a component with wood texture, such as skinned furniture and skinned speakers Wait. [0003] However, it is difficult to implement the skin-mounting technology when it encounters an uneven surface, and after a period of use, the skin-mounted component will often warp or deform due to the aging of the skin, which will cause it to be incompatible with other materials. The pro...
Claims
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Login to View More IPC IPC(8): H05K5/00B27M3/00B27M1/08
Inventor 蔡升佑
Owner ASUSTEK COMPUTER INC