Thermal head and its manufacturing method

Abstract

The present invention provides a thermal head and manufacturing method thereof enabling reduction in size of the head and free from a print flaw. The thermal head includes a plurality of resistor strips arranged with specified spaces; a plurality of insulating barrier layers for covering part of each resistor strip and defining heating resistors generating heat by energization; and a plurality of connection conductors electrically connecting the ends of a pair of the resistor strips; the connecting conductors comprise a pair of parallel conductor sections extended on the ends of the two adjoining conductors and an insulating barrier layer and a connecting conductor section for connecting the two parallel conductor sections at least at the edge of the heating resistor side.

Description

Thermal head and manufacturing method thereof The present application is a divisional application with the application number 200510099866.3 filed by the applicant on September 8, 2005, and the title of the invention is "Thermal Head and Its Manufacturing Method". technical field The present invention relates to a thermal head mounted on, for example, a thermal transfer type printer and a method of manufacturing the same. Background technique The thermal head has on the substrate with good heat dissipation: a heat storage layer made of high heat insulating materials such as glass, a plurality of heating resistors that generate heat when energized, a common electrode that is connected to all heating resistors, A plurality of independent electrodes respectively connected to each heating resistor conduct printing operation by pressing the heating resistor that generates heat through the common electrode and the independent electrode on the ribbon or printing medium (thermal ...

AI Technical Summary

Problems solved by technology

In order to avoid this phenomenon, it can be considered to cut off the pocket-shaped recesses while grinding the step 110a of the wear-resistant protective layer 110, but because the step 110a of the wear-resistant protective layer 110 is located on the protruding shape of the heat storage layer 103, it is difficult to cut off Pockets, which cannot be completely eliminated

In addition, although the pocket-shaped concave portion can be made shallower if the Al conductor layer C constituting the folded conductor 111 is thinned, if the thickness of the Al conductor layer C is reduced, the resistance is increased.

In particular, due to the miniaturization of the head in recent years and the reduction of the electrode area, the electrode resistance has increased significantly, deteriorating the printing quality of the thermal head.

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