Radiation system for calculation processing arrangements and equipment adopting the heat radiation system

A heat dissipation system and processing equipment technology, applied in computing, electrical digital data processing, digital data processing components, etc., can solve the problems of reducing the comfort of the working environment, lack of installation flexibility, and large differences in working room temperature, so as to achieve installation and Easy to replace, convenient for centralized management, and reduce the effect of local temperature difference

Inactive Publication Date: 2012-08-22
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above heat dissipation methods have disadvantages: (1) The heat dissipation efficiency is low, resulting in high cooling costs including equipment investment and energy consumption; (2) The noise produced by forced air convection is large; (3) The local temperature difference in the working room is large
Both (2) and (3) will reduce the comfort of the working environment and affect work efficiency
[0006] At present, many inventions focus on improving the heat dissipation efficiency of computers, such as US Patent Publication No. 2007209782A1, which uses a fluid circuit for cooling, but its fluid cooling medium channels are connected by welding, which lacks installation flexibility

Method used

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  • Radiation system for calculation processing arrangements and equipment adopting the heat radiation system
  • Radiation system for calculation processing arrangements and equipment adopting the heat radiation system
  • Radiation system for calculation processing arrangements and equipment adopting the heat radiation system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as figure 2 As shown, in this embodiment, the heat-conducting connector of the present invention is used in a computer 1 , which includes a case 11 , a heat source 12 inside the computer 1 , and a heat-conducting connector 13 arranged on the case 11 and connected to the heat source 12 . The heat source 12 includes a CPU, a DSP, or an integrated chip of a CPU and a DSP, but is not limited to the above-mentioned heat source, and may also include other heating elements inside the computer 1 . The heat transfer modes between the computer 1 and the cooling circuit 2 include plug-in solid / solid contact heat transfer, fluid / solid interface heat exchange and heat transfer, and the like.

[0043] Such as image 3 As shown, the heat conduction connector 13 of the first embodiment of the heat conduction connector of the present invention includes a connector housing 131 installed on the computer 1, a heat pipe 132 arranged in the connector housing 131 and connected to the h...

Embodiment 2

[0046] Such as Figure 4 As shown, other parts of this embodiment are the same as Embodiment 1, the difference is:

[0047] The first heat conductor 1311 and the second heat conductor 1312 also have sawtooth heat conduction ribs 1310 on the outer surfaces, and the sawtooth heat conduction ribs 1310 in this embodiment are perpendicular to the extension direction of the heat pipe 132 (that is, parallel to the extension direction of the conduit 133 Vertical), can also achieve the effect of increasing the heat transfer area and enhancing the heat dissipation effect.

Embodiment 3

[0049] Such as Figure 5 The thermally conductive connector 13 shown is a single closed solid / fluid thermally conductive type. The heat-conducting connector 13 includes a connector housing 131 mounted on the chassis 11 of the computer 1 , and a heat pipe 132 disposed in the connector housing 131 and connected to the heat source 12 . The connector housing 131 is a single-layer structure with a fluid inlet 1313 and a fluid outlet 1314 on both sides. The cooling medium enters the connector housing 131 from the fluid inlet 1313, exchanges heat with the heat pipe 132, and then absorbs the heat for cooling. The media exits the connector housing 131 through fluid outlet 1314 . That is, heat exchange is performed between the solid heat pipe 132 and the fluid cooling medium to cool the heat pipe 132 . Spiral fins or external threads 1321 are arranged inside the connector housing 131 and around the heat pipe 132, and the fins or external threads 1321 can be welded on the end of the he...

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Abstract

The invention discloses a cooling system for a computing processing device or a computing processing unit and comprises a heat pipe which educes the heat of a heating component of the cooling system, and a cooling loop outside the heat pipe; the cooling system further comprises a thermal conductive connector which comprises a cooling media channel; the cooling loop outside the heat pipe and the cooling media channel of the thermal conductive connector form a circulation loop of the cooling medium; the heat pipe has a condensation end which is arranged inside the thermal conductive connector and created heat transfer with the cooling medium in the cooling medium channel. The cooling system of the invention has simple assembly, high thermal efficiency and low noise, and can effectively reduce the local temperature difference in a computer room.

Description

technical field [0001] The present invention relates to a cooling system for computing processing equipment or computing processing units and equipment using the cooling system, especially computing processing equipment and computing processing systems. Background technique [0002] With the increasing integration of computer chips, the heat dissipation of computers has become an important factor affecting computer performance. The CPU on the main board and the DSP on the graphics card are the main heat sources inside the computer. Strengthening the cooling of them is an important topic of computer research, especially for workstations, servers and other areas where computers are dense and have a large heat dissipation, the demand for heat dissipation is even greater. high. At present, the main heat dissipation method of computer is to dissipate heat through forced convection or first utilize heat conductor or heat pipe to transfer heat to the chassis, and then discharge he...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G06F1/20
Inventor何振辉祁新梅孙西辉黄臻成张展
OwnerSUN YAT SEN UNIV