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Electropolating hangers

An electroplating hanger and metal electroplating technology, applied in the electrolysis process, electrolysis components, etc., can solve the problems of inability to be plated by plating, limit the size of the plated object, etc., and achieve the effect of less scorching and less possibility of contact

Inactive Publication Date: 2011-01-12
UMG ABS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Moreover, the existing electroplating racks limit the size of the fixed objects to be plated, and it is impossible to electroplate objects of various sizes with one electroplating rack

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] A notebook computer (A4 size) of length 260mm x width 180mm x 1.5mm was produced by injection molding using flame-retardant PC (polycarbonate) / ASA-based carbon fiber-reinforced resin (UMG alloy FA-820CA) manufactured by UMG ABS Co., Ltd. The upper cover (upper casing) of the PC / ABS resin is electroless-plated with a thickness of 1.0 μm as the object to be plated by using the known PC / ABS resin electroless plating process. Then, install the object to be plated on the Figure 8 Shown on the plating rack 1. The electrical contacts are provided on the inner wall (corresponding to the surface 62 ) of the object to be plated. The shielding plate 70 uses a thickness of 3mm and an opening area of ​​200cm 2 acrylic board. The target plating thickness of the central portion of the object to be plated was set to 15 μm, the distance between the shielding plate 70 and the object to be plated was set to 50 mm, and the plating time was 20 minutes to conduct nickel electroplating. ...

Embodiment 2

[0094] Except that the target coating thickness is set as 20 μm, and the electroplating time is 26 minutes, other is the same as embodiment 1.

Embodiment 3

[0096] Except that the target coating thickness is set to 25 μm and the electroplating time is 32 minutes, the others are the same as in Example 1.

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Abstract

The invention provides an electroplating rack capable of avoiding the falling off, warping, junction scorch of an electroplated object, and fully controlling the coating thickness, thereby, the electroplating can be performed on various objects to be electroplated with different sizes and shapes. The electroplating rack used for metal plating the object to be electroplated with a protrusion (61) is characterized of comprising a plurality of movable members (4) for fixing which can move along the same direction respectively and are provided with fixing post (51) disposed on the protrusion (61)of the object to be electroplated. An electrical contact (34c) is arranged on the outer side face of the protrusion (61) of the object to be electroplated or on a plane (62) forming with the protrusion (61) of the object to be electroplated.

Description

technical field [0001] The invention relates to an electroplating hanger. Background technique [0002] Methods of plating the surface of an object to be plated are broadly classified into electroplating and electroless plating. Electroplating is performed by using an aqueous or non-aqueous solution in which a metal salt is dissolved as a plating solution, immersing an object to be plated in the plating solution as a part of the cathode, and passing electricity through the electrodes. Through this electrolysis, the metal is deposited from the plating solution onto the object to be plated at the cathode, and the object to be plated is electroplated. Metals used for electroplating include, for example, nickel, chromium, and copper. [0003] Electroplating is carried out by fixing the object to be plated on the electroplating rack. Therefore, it is necessary to firmly fix the object to be plated on the electroplating hanger so that the object to be plated will not fall into ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/08
Inventor 酒井比吕志
Owner UMG ABS