Soldered ball surface defect detection device and method based on machine vision

A technology of machine vision and defect detection, applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of ineffective detection of solder ball surface defects, affecting chip quality, high false detection rate, etc., and achieve accurate detection of solder ball surface defects , Simple device structure and strong classification ability
CN101424645BInactive Publication Date: 2011-04-20SHANGHAI JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI JIAOTONG UNIV
Publication Date
2011-04-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a device and a method based on machine vision for detecting the surface defects of solder balls in the field of automatic optical detection. An optical imaging system collects chip images, and an image collection system receives the collected chip images, intercepts a single-frame gray image from video stream signals output by the optical imaging system, and stores the single-frame gray image in the form of a two-dimensional integer matrix; an image segmentation module segments the whole two-dimensional integer matrix corresponding to the whole image into subsidiary matrices containing the solder balls, an image characteristic extraction module receives and processes the two-dimensional integer subsidiary matrices output by the mage segmentation module and outputsa one-dimensional floating point vector, and a probability neural network module receives, trains, and tests the one-dimensional floating point vector output by the image characteristic extraction module and divides the solder balls into two categories, namely good solder balls and defective solder balls. The device of the invention has simple structure, the graduation of a characteristic extraction method and a probability neural network is good, and the accuracy is high so as to realize the NDE (Non-Destructive Examination) of the surface defects of the solder balls.
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Description

technical field

[0001] The invention relates to a detection device and method in the technical field of optical detection, in particular to a machine vision-based detection device and method for solder ball surface defects. Background technique

[0002] With the development of chip production and packaging technology, the traditional chip production method based on solder pins can no longer meet the requirements, and it has been replaced by surface mount technology based on solder balls, a typical representative of which is the ball grid array chip BGA. As an important connecting part, solder ball quality plays an important role in chip quality. Due to the small size of solder balls, manual visual inspection is not only inefficient, but also has a high false detection rate. Therefore, many solder ball quality detection devices and methods have emerged.

[0003] After searching the literature of the prior art, it was found that Chinese Patent Publication No. CN101136346, pub...

Claims

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