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Layered body and method for manufacturing thin substrate using the layered body

A stacked, substrate technology, applied in the manufacture of thin substrates, the field of manufacturing the stacked main body, can solve the problems of thin wafer separation, thinning of semiconductor wafers, etc.

Inactive Publication Date: 2009-07-22
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to this method, the wafer can be processed to a lower thickness level when compared with the above method, however, the thin wafer cannot be separated from the support without breaking the wafer, and therefore, this method cannot be used practically for making semiconductor Wafer Thinning Method

Method used

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  • Layered body and method for manufacturing thin substrate using the layered body
  • Layered body and method for manufacturing thin substrate using the layered body
  • Layered body and method for manufacturing thin substrate using the layered body

Examples

Experimental program
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Effect test

example 1

[0139] A mixture of 100.0 grams of VQM-135, 7.2 grams of SYL-Off 7678, and 4.4 mg of catalyst was prepared in an amber bottle. A 75 micron thick layer of the adhesive composition was coated onto the polyimide passivation layer of the silicon wafer using a notched bar coater. A sheet of LTHC glass was placed on the adhesive with the LTHC layer facing the wafer. This sandwich was passed under a UV processor (Fusion D lamp, low power consumption, exposure time approximately 15 seconds). UV light shines through the glass and cures the adhesive. After prying the glass off the wafer, the residual adhesive layer adhered to the glass and was cleanly removed from the polyimide surface.

example 2

[0141] A mixture of 56.0 grams of VQM-135, 42.0 grams of DMS-V31 and 140.0 grams of VQX-221 was prepared in a glass bottle. Remove the xylene solvent using a rotary evaporator attached to a vacuum pump. To the resulting mixture was added 17.5 grams of SYL-Off 7678 and 7.7 mg of catalyst. Using a kerf bar, a 75 micron thick layer of the adhesive composition was coated onto the polyimide passivation layer of the silicon wafer. A sheet of LTHC glass was placed on the adhesive with the LTHC layer facing the wafer. This sandwich was passed under a UV processor (Fusion D lamp, low power consumption, exposure time approximately 15 seconds). UV light shines through the glass and cures the adhesive. After prying the glass off the wafer, the residual adhesive layer adhered to the glass and was cleanly removed from the polyimide surface.

[0142] Example of Methacrylated Polydibutylene Embodiment of Tie Layer :

[0143] Table 1 shows the formulation components and trade names used...

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Abstract

Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority to U.S. Patent Application No. 11 / 457567 filed on July 14, 2006 and U.S. Patent Application Attorney Docket No. 63350US002 filed on the same date, the disclosure of which is incorporated by reference in its entirety way incorporated into this article. technical field [0003] The present invention relates to a laminated body from which a substrate to be ground, such as a silicon wafer, fixed on a support can be easily detached, and to a method of manufacturing the laminated body and to a method for manufacturing a thin substrate. method. Background technique [0004] Reducing the thickness of a substrate is often critical in various technical fields. For example, in the field of quartz devices, it is necessary to reduce the thickness of the quartz wafer to increase the oscillation frequency. Especially in the semiconductor industry, efforts are being made to further re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/02B32B33/00
CPCH01L21/6836H01L2221/68386B32B2310/0806H01L2221/68327B32B37/12H01L21/6835H01L2221/68381B24B7/228B32B2457/14Y10T428/31663B32B33/00B32B37/02
Inventor 理查德·J·韦伯迈克尔·A·克罗普
Owner 3M INNOVATIVE PROPERTIES CO