Chip pickup method and chip pickup apparatus

Abstract

The present invention provides a pickup method and a pickup apparatus wherein pushing up of a chip is not required and a force for holding a chip which is not picked up is not varied as pickup progresses. A method is provided for picking up a chip (13) from a fixed jig (3) to which the chip (13) is fixed. The fixed jig (3) consists of a jig base (30) having a plurality of protrusions (36) on one side and a sidewall (35) of substantially the same height as that of the protrusion (36) at the outer circumference of the one side, and an adhesion layer (31) laminated on the surface of the jig base (30) having the protrusions (36) and bonded on the upper surface of the sidewall (35). A section space (37) is formed on the surface of the jig base (30) having the protrusions by the adhesion layer (31), the protrusions (36) and the sidewall (35), and at least one through hole (38) penetrating the outside and the section space (37) is provided in the jig base (30). The pickup method comprises a step for fixing a chip, a step for deforming the adhesion layer (31) by sucking air in the section space (37) through the through hole (38), and a step for picking up the chip (13) completely from the adhesion layer (31) by sucking the chip (13) from the upper surface side of the chip (13) by means of a suction collet (70).

Description

technical field [0001] The present invention relates to a pick-up method and a pick-up device without chip jacking, in particular to a chip pick-up method and pick-up device capable of picking up an extremely thin and large-area semiconductor chip without damaging it. Background technique [0002] In recent years, with the spread of IC cards and portable electronic devices, semiconductor devices are expected to be further thinned. Therefore, it is necessary to reduce the thickness of the conventional semiconductor wafer, which is about 350 μm in thickness, to 50 to 100 μm or less. [0003] Semiconductor chips are formed by cutting the back surface to a predetermined thickness after forming the surface circuits, and dicing each circuit. In addition, as another method, it is also possible to form a semiconductor chip by forming a groove exceeding a predetermined thickness from the circuit surface after forming the surface circuit, and grinding to a predetermined thickness fro...

AI Technical Summary

Problems solved by technology

However, in this method, the gap between the chips is not blocked, the air leaks, and the leakage increases each time the chip is picked

According to this, there are problems that the holding force of the chip left without being picked up is lowered, the position of the chip is deviated due to vibration, and the chip cannot be grasped by the chuck.

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