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Detection method of separation blade recovery in chip manufacturing process

A detection method and manufacturing process technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve the problems of waste of baffles, reduce production costs, increase the utilization rate of baffles, The effect of saving a lot of baffles

Active Publication Date: 2009-10-14
SEMICON MFG INT (SHANGHAI) CORP
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AI Technical Summary

Problems solved by technology

In the prior art, the method of detecting whether the baffle can be used again is usually to manually measure the thickness of the baffle and check the pollution and smoothness of the back of the baffle, such as whether there are scratches or defects with a large area. If it is qualified, the baffles are directly discarded and scrapped, but this method is too subjective so that a large number of baffles that could have been recycled are considered scrapped and discarded, resulting in waste. At the same time, the used baffles are not turned over and recycled again Case

Method used

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  • Detection method of separation blade recovery in chip manufacturing process
  • Detection method of separation blade recovery in chip manufacturing process

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Embodiment Construction

[0015] In order to better understand the technical content of the present invention, preferred specific embodiments are given together with the attached drawings for description as follows.

[0016] Please refer to figure 1 , figure 1 Shown is a flow chart of a preferred embodiment of the present invention. The present invention proposes a method for detecting the recovery of the blocking sheet in the chip manufacturing process, which includes: step 10: obtaining the used blocking sheet, step 20: turning the above blocking sheet over, and step 30: detecting the front side of the above blocking sheet to obtain Relevant detection data, step 40 : judging whether the blocking sheet can be recycled according to the detection data.

[0017] According to a preferred embodiment of the present invention, the step 30 of the detection method for recovering the above-mentioned blocking sheet, and obtaining relevant detection data further includes step 31: detecting the above-mentioned b...

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Abstract

The invention provides a detection method of separation blade recovery in a chip manufacturing process. The detection method comprises the following steps: obtaining used separation blades; overturning the separation blades; detecting the front sides of the separation blades; obtaining relevant detection data; and judging whether the separation blades can be recovered according to the detection data which comprises thickness and angularity. The used separation blades are overturned and the front sides are detected for recovery, thereby numerous separation blades are saved, the requirement for numerous separation blades in the chip manufacturing procedure is met, the use ratio of the separation blades is improved, and meanwhile, the production cost is greatly reduced.

Description

technical field [0001] The invention relates to a wafer detection method in a chip manufacturing process, and in particular to a detection method for blocking sheet recovery. Background technique [0002] In the chip manufacturing process, the wafers cut from the middle section of the wafer bar are of high quality, called production wafers, and are used for semiconductor chip manufacturing. Wafers cut at both ends of the wafer bar have a higher probability of defects and are mostly used for non-production purposes, called test wafers such as control wafers and dummy wafers. [0003] Before the equipment in the semiconductor wafer factory is produced, it is necessary to measure the temperature of the furnace tube, metal layer, chemical concentration, and deposition thickness with test wafers. The manufacturing process of semiconductor devices has more than 100 procedures, so a large number of tests are required. wafers, however test wafers are expensive and need to be reused...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/66
Inventor 万世伟王军张福全
Owner SEMICON MFG INT (SHANGHAI) CORP
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