Room temperature curing epoxy adhesive and preparation method thereof

An epoxy resin, room temperature curing technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the physical and chemical properties of epoxy resin adhesive fire resistance, acid resistance, insulation, melting point and flexibility and The luster is not enough to meet the expected requirements, the tensile strength and shear strength are low, the preparation process is complicated, etc., and the curing effect is ideal, the preparation method is concise, and the formula selection is reasonable.

Active Publication Date: 2009-12-16
常熟市江南粘合剂有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The above-mentioned patent applications and patents basically have the following common shortcomings: first, the tensile strength and shear strength are low, and it is difficult to meet the stringent requirements of the applicant for 3G radio frequency optical cables, photoelectric integrated cables and submarine optical cables, etc. Adhesive requirements, the applicant also analyzed the above patent application and the raw materials of the patented technical solution and entrusted the scientific research department to conduct some experiments. All will have a corresponding impact on the aforementioned tensile strength and shear strength. At present, whether it is the technology disclosed in the literature or the actual production in the industry, almost all use short-chain aliphatic amine curing agents; the second is the physical and chemical properties of epoxy resin adhesives. Characteristics such as lubricity, anti-adhesion, flow aid, fire resistance, acid resistance, insulation, melting point, softness and gloss are not enough to meet the requirements of actual use; the third is that the preparation process is complicated

Method used

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  • Room temperature curing epoxy adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A) Preparation of component A: first weigh 80 parts of E-44 epoxy resin (also known as 6101 epoxy resin), 28 parts of talcum powder, 3.5 parts of fumed white carbon black and 10 parts of dibutyl phthalate by weight. Parts, put the aforementioned E-44 epoxy resin, talcum powder, fumed silica and dibutyl phthalate into a mixing device with a stirrer and mix, and the speed of the stirrer of the mixing device is controlled It is 90n / min, after mixing for 25min, the mixture is obtained, then the mixture is dropped into a three-roller grinder for grinding, and the belt transfer of the grinding roller of the three-roller grinder is controlled to be 35n / min, after 70min grinding, component A is obtained, Pack component A according to the required packaging specification;

[0023] B) Preparation of component B: First weigh 25 parts of T30 long-chain fatty amine modified curing agent, 35 parts of kaolin, 1.5 parts of fumed silica, 2 parts of dibutyl phthalate and KH-550 silane by...

Embodiment 2

[0026] A) Preparation of component A: First weigh 100 parts of E-44 epoxy resin (also known as 6101 epoxy resin), 12 parts of talcum powder, 1.2 parts of fumed white carbon black and 3 parts of dibutyl phthalate by weight. Parts, put the aforementioned E-44 epoxy resin, talcum powder, fumed silica and dibutyl phthalate into a mixing device with a stirrer and mix, and the speed of the stirrer of the mixing device is controlled It is 70n / min, after mixing 35min, obtain compound, then compound is put into three-roll mill grinding, and the belt transfer control of the grinding roller of three-roll mill is 140n / min, obtains component A after 50min grinding, Pack component A according to the required packaging specification;

[0027] B) Preparation of component B: first weigh 45 parts of T30 long-chain fatty amine modified curing agent, 20 parts of talcum powder, 2 parts of fumed white carbon black, 3 parts of dibutyl phthalate and KH-550 4 parts of silane coupling agent, put the a...

Embodiment 3

[0029] A) Preparation of component A: first weigh 92 parts of E-44 epoxy resin (also known as 6101 epoxy resin), 16 parts of talcum powder, 5 parts of fumed white carbon black and 6 parts of dibutyl phthalate by weight. Parts, put the aforementioned E-44 epoxy resin, talcum powder, fumed silica and dibutyl phthalate into a mixing device with a stirrer and mix, and the speed of the stirrer of the mixing device is controlled It is 80n / min, after mixing for 30min, the mixture is obtained, and then the mixture is dropped into a three-roller grinder for grinding, and the belt transfer of the grinding roller of the three-roller grinder is controlled to be 100n / min, and component A is obtained after grinding for 60min. Pack component A according to the required packaging specification;

[0030]B) Preparation of component B: first weigh 35 parts of T30 long-chain fatty amine modified curing agent, 28 parts of titanium dioxide, 1 part of fumed white carbon black, 1 part of dibutyl phth...

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Abstract

The invention relates to a room temperature curing epoxy adhesive, which belongs to the technical field of adhesives. The room temperature curing epoxy adhesive comprises a component A and a component B, wherein the component A is prepared from the following raw materials in portion by weight: 80 to 100 portions of epoxy, 10 to 30 portions of filling, 1 to 5 portions of white carbon black and 2 to 10 portions of plasticizer; the component B is prepared from the following raw materials in portion by weight: 24 to 50 portions of long-chain aliphatic amine modified curing agent, 18 to 35 portions of filling, 1 to 2 portions of white carbon black, 1 to 3 portions of plasticizer and 2 to 4 portions of coupling agent; and the weight ratio of the component A to the component B is 2:0.8-1.3. The room temperature curing epoxy adhesive has the advantages of tensile strength up to 32 to 35 and shear strength up to 25 to 28 due to the reasonable selection of formula, particularly the selection of the long-chain aliphatic amine modified curing agent in the component B, ideal curing effect to achieve complete curing within 5.5 to 8 hours and simple preparation method without complicated equipment to meet the requirement of industrial production.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to a room temperature curing epoxy resin adhesive, and also relates to a preparation method of the adhesive. Background technique [0002] With the rapid development of electric power and communication technology, 3G radio frequency optical cable, photoelectric integrated cable (also known as optical integrated cable) and submarine optical cable are widely used. Next, epoxy resin adhesives are widely used in the aforementioned construction operations due to their advantages of short curing time, good tensile shear strength, ease of use, and low cost. [0003] Regarding epoxy resin adhesives, there have been a large number of literature reports, such as ①. Chinese Invention Patent Authorization Announcement No. CN1233768C discloses epoxy resin adhesives containing maleimide and its preparation method. The raw materials used are: bismaleimide Amine-modified all-meta-aromatic ether ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/06
Inventor 陆建刚陆瑞明
Owner 常熟市江南粘合剂有限公司
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