Lead frame material band, combination of insulated shell and same and LED module using combination
A technology of insulating shells and strips, which is applied in the direction of semiconductor devices, semiconductor devices of light-emitting elements, semiconductor/solid-state device parts, etc., which can solve the problems of difficult alignment of printed circuits, small size of light-emitting grains, and high processing difficulty.
Inactive Publication Date: 2015-06-10
LITE ON OPTO TECH (CHANGZHOU) CO LTD +2
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Problems solved by technology
[0002] In the past, products aimed at surface light sources or light sources that required a large number of light-emitting crystals were arranged on a circuit board by arranging a large number of light-emitting crystals, and then soldered on the circuit board by reflow soldering and wave soldering. However, , in the process of reflow soldering and wave soldering, due to the small size of the light-emitting grains, it is not easy to align with the printed circuit on the circuit board, and there is a problem of high processing difficulty
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[0018] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings.
[0019] refer to figure 1 A preferred embodiment of the light-emitting diode module of the present invention is actually a panel light source and includes a conductive frame assembly 1, a plurality of light-emitting crystal grains A-I, and an insulating case combined with the conductive frame assembly 1 Body 3 and a plurality of light-transmitting colloids 4 combined in the insulating casing 3 and encapsulating the light-emitting chips A-I respectively. The conductive frame assembly 1 is partly exposed outside the insulating casing 3 and can be connected to an external power source. Due to the structural setting of the conductive frame assembly 1 itself, among the light-emitting crystal grains A-I, each row of light-emitting crystal grains A-C, D-F, and ...
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The invention relates to a lead frame material band, the combination of an insulated shell and the same and an LED module using the combination. The lead frame material band comprises two first conduction frames and at least two second conduction frame units, wherein the two first conduction frames are mutually spaced, extend along a first direction and are used for connecting an external power supply; the two second conduction frame units are arrayed between the two first conduction frames along a second direction which is different from the first direction, and a first fixed crystalline region is supplied between each first conduction frame and any one second conduction frame unit. Because a printed circuit of a circuit board is replaced by using the conduction frame, the invention solves the problem that public-known luminescent grains are difficult to position and can be difficultly processed, the conduction frames which can be provided with different numbers of luminescent grains can be changed by punching the second conduction frame units with different group numbers and different numbers of second conduction frames so as to manufacture surface light sources with different sizes.
Description
technical field [0001] The invention relates to a conductive frame strip, a combination of the conductive frame strip and an insulating case, and a light-emitting diode module using the combination, in particular to a metal sheet die-cutting and re-cutting And the conductive frame strip as the conductive circuit for conducting the light-emitting crystal grains, the combination of the conductive frame strip and the insulating casing, and the light-emitting diode module using the combination. Background technique [0002] In the past, products aimed at surface light sources or light sources that required a large number of light-emitting crystals were arranged on a circuit board by arranging a large number of light-emitting crystals, and then soldered on the circuit board by reflow soldering and wave soldering. However, In the process of reflow soldering and wave soldering, due to the small size of the light-emitting crystal grains, it is not easy to align with the printed circ...
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IPC IPC(8): H01L23/495H01L33/62F21V23/00F21Y115/10
CPCH01L2224/97
Inventor 黄仕冲林贞秀周孟松
Owner LITE ON OPTO TECH (CHANGZHOU) CO LTD