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Lamp for rapid thermal processing chamber

A technology of surface treatment and light bulbs, applied in the direction of incandescent lamps, heat dissipation design, incandescent lamp parts, etc.

Active Publication Date: 2013-02-27
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While bulbs with heat shields or reflectors may be effective, these require additional components to be built into the lamp assembly

Method used

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  • Lamp for rapid thermal processing chamber
  • Lamp for rapid thermal processing chamber
  • Lamp for rapid thermal processing chamber

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Embodiment Construction

[0055]Embodiments of the invention generally provide a lamp assembly suitable for heating a substrate to a temperature of up to at least about 1100°C (eg, up to about 1350°C) in a substrate thermal processing chamber. In accordance with one or more embodiments, a lamp assembly, which may be used in a rapid thermal processing apparatus in semiconductor substrate processing, is designed to allow heat to flow away from the bulb and to avoid light flow towards the lamp socket. According to the embodiments of the present invention, it is expected that the lifetime of the bulb can be extended, and premature bulb failure caused by overheating of the bulb and the lamp socket can be avoided. In the following description, specific descriptions are given to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, existing components have no...

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Abstract

A lamp assembly for the lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface and an outer surface, a lamp base configured to receive the pair of leads and at least a portion of the bulb having a surface treatment adapted to reflect light away from the lamp base. In another embodiment, a sleeve covers the lamp base, which has a cross-sectional area less than about 1.2 times the cross-sectional area of the bulb.

Description

[0001] related application [0002] This application claims priority to US Patent Application No. 11 / 675,150, filed February 15, 2007, which is hereby incorporated by reference in its entirety. technical field [0003] Embodiments of the present invention relate generally to semiconductor processing systems, and more particularly to lamps for advanced heating in semiconductor processing systems. Background technique [0004] Rapid thermal processing (RTP) systems are employed in semiconductor chip fabrication to create, chemically alter or etch surface structures on semiconductor substrates or wafers. RTP typically relies on arrays of high intensity incandescent lamps housed in lamp heads and facing the substrate or wafer, these lamps are powered and can be turned off and on very quickly, with most of the emitted light being directed toward the substrate. Thus, the wafer can be heated quickly without greatly heating the chamber, and can be cooled at an almost as fast rate a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F26B19/00
CPCH01K1/325H01K7/00H01K1/58H01K1/32H01K1/46H01L21/67115H01K1/28H05B3/0047
Inventor J·M·瑞尼西K·索拉吉
Owner APPLIED MATERIALS INC