Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit board

A circuit board and circuit layer technology, which is applied in the direction of assembling printed circuits with electric components, can solve the problems of easy short circuit and difficult circuit layout, and achieve the effect of avoiding difficult layout

Inactive Publication Date: 2010-01-20
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the development of technology, the circuit board has developed from a single layer to a multi-layer circuit board formed by stacking multiple circuit layers. In this way, when the through hole is provided on the multi-layer circuit board, the The through-holes run through each of the circuit layers, and the through-holes are often numerous in number and densely arranged, occupying a large area of ​​each of the circuit layers, making it difficult to arrange the circuits of each layer and prone to short circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board
  • Circuit board
  • Circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0023] refer to Figure 1 to Figure 4 , the circuit board 2 of the present invention is a multilayer circuit board (such as image 3 and Figure 4 shown), which is used for soldering to communicate with an electrical connector 1 . The circuit board 2 is stacked up and down by the first circuit layer 22, the second circuit layer 23, the third circuit layer 24, the fourth circuit layer 25, the fifth circuit layer 26 and the sixth to eighth circuit layers (not labeled). become. Wherein connecting the first circuit layer 22, the second circuit layer 23, the third circuit layer 24 and the fourth circuit layer 25 is provided with a plurality of blind holes 21, and each of the blind holes 21 is arranged in a matrix , and its opening is located on the upper surface of the circuit board 2 (that is, the surface of the first circuit layer 22). The d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a circuit board which is formed by the stacking of a plurality of line layers. The circuit board is provided with at least a blind hole; each blind hole is internally provided with a weldable part, and is filled with solder, wherein at least part of the line layers is positioned below the blind hole; and poor welding can not occur on the weldable part of the circuit board, and the corresponding pins of an electronic assembly are inserted into and welded in the weldable part; in addition, the arrangement of the blind hole has no influence on the line layers thereunder, therefore, the line layers have enough laying areato avoid laying difficulties and short circuit.

Description

[0001] The present invention is filed on April 22, 2005; the application number is 2005100343089; the title of the invention is a divisional application of a welding method and a circuit board using the welding method. 【Technical field】 [0002] The invention relates to a circuit board, in particular to a multilayer circuit board. 【Background technique】 [0003] At present, methods for soldering an electrical connector to a circuit board include surface mount (SMT) technology and through-hole (Through-Hole) technology. [0004] When using SMT technology, refer to Figure 5 , Figure 6 As shown, the conductive sheet is generally provided on the circuit board, and the solder paste is directly placed on the conductive sheet provided on the circuit board, and the conductive terminal of the electrical connector is connected to the conductive sheet by melting the solder paste. The conductive sheet is welded to realize its electrical connection. However, due to the bending deform...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 张文昌
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU