Soldering flux for solder wires for robotic automatic welding and preparation method thereof

Abstract

The invention provides soldering flux for solder wires for robotic automatic welding. The soldering flux comprises, by weight, 6.0-11.0% of linear polymer, 5.0-8.5% of high-temperature solvent, 2.0-3.5% of active agent, 0.2-1.2% of surfactant, and the balance of rosin resin. The soldering flux has the advantages that the problem that the flux easily breaks and is easily uneven can be avoided; surface tension of molten solder is reduced, wetting power is increased, weldability of the solder is enhanced, the solder is squeezed to the solder wires at agreeably high temperature and is full and even, and high wetting and expansion rate of the solder wires can be guaranteed; welding defectives such as tin bonding and missing solder during robotic automatic welding can be avoided.

Description

technical field

[0001] The invention relates to the field of soldering flux, and more specifically relates to a soldering flux for robot automatic welding solder wire and a preparation method thereof. Background technique

[0002] With the rapid development of the electronics industry, electronic products are becoming more and more miniaturized and sophisticated. In the past, most electronic products were soldered and assembled by wave soldering, but wave soldering required manual insertion of components, resulting in low production efficiency, high energy consumption, and high material costs. At present and in the future, a large number of reflow furnaces will be used for chip soldering. This process not only overcomes the above-mentioned shortcomings of wave soldering, but also makes electronic products smaller and more precise. Reflow soldering has many advantages, but some special components in the reflow soldering process must still be soldered manually with solder wir...

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