Flexible printed circuit board

A flexible printing and circuit board technology, which is applied in the direction of printed circuit components, electrical connection printed components, etc., can solve the problems of difficult control of insertion depth, inaccurate or offset, large tolerance of silk screen alignment line, etc., to improve FPC Reliable performance of electrical contact, avoiding misalignment or offset, and improving the effect of plugging positioning accuracy

Active Publication Date: 2010-01-27
深圳市合力泰光电有限公司
View PDF0 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, due to the large tolerance of the silk screen alignment line itself, there is also a large error when judging that the FPC is inserted to be flush with the silk screen alignment line, and the bending area is bent by force, tha

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible printed circuit board
  • Flexible printed circuit board
  • Flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0053] Embodiment one

[0054] FIG. 2( a ) is a schematic diagram of the back structure of a flexible printed circuit board according to an embodiment of the present invention. Fig. 2(b) is a schematic diagram of the structure in direction B in Fig. 2(a). see Figure 2(a) ~ Figure 2(b) , the FPC includes: an insulating cover film layer 1, a conductive copper foil 2, an insulating base material 3 and a first reinforcing plate 4, and the insulating cover film layer 1 and the conductive copper foil 2, and the conductive copper foil 2 and the insulating base are respectively connected by an adhesive. Material 3, insulating base material 3 and first reinforcing plate 4.

[0055] The material of the insulating cover film layer 1 is high temperature resistant, high-strength flexible polymer material polyimide, and the end of the insulating cover film layer 1 facing the FPC insertion direction is slotted, so that one end of the conductive copper foil 2 is exposed to the insulating co...

Example Embodiment

[0064] Embodiment two

[0065] FIG. 3( a ) is a schematic diagram of the back structure of the flexible printed circuit board according to Embodiment 2 of the present invention, and FIG. 3( b ) is a schematic diagram of the structure along the direction C in FIG. 3( a ). see Figure 3(a) ~ Figure 3(b) ,and Figure 2(a) ~ Figure 2(b) The difference is that the FPC also includes: the first reinforcing film 5,

[0066] Connect the insulating base material 3 and the first reinforcing plate 4 through the first reinforcing film 5, between the first reinforcing film 5 and the insulating base material 3, and between the first reinforcing film 5 and the first reinforcing plate 4 Glued together with adhesive.

[0067] The thickness of the first reinforcing film 5 can be 0.008-0.025 mm. Along the FPC insertion direction, the first reinforcing film 5 is about 1-3 mm longer than the first reinforcing plate 4, that is, one end of the first reinforcing film 5 It is flush with the insertio...

Example Embodiment

[0074] Embodiment Three

[0075] FIG. 4( a ) is a schematic diagram of the back structure of the flexible printed circuit board according to Embodiment 3 of the present invention, and FIG. 4( b ) is a schematic diagram of the structure in the direction D of FIG. 4( a ). see Figure 4(a) ~ Figure 4(b) ,and Figure 2(a) ~ Figure 2(b) The difference is that the FPC also includes: a second reinforcing plate 8,

[0076] The second reinforcing plate 8 is bonded to the insulating base material 3 through an adhesive;

[0077] The thickness of the second reinforcing plate 8 is the same as that of the first reinforcing plate 4, and the length is about 1-5 mm. There is 0.2-0.5 mm between the second reinforcing plate 8 and the first reinforcing plate 4 in the direction of FPC insertion. The insulating substrate transition region 10 serves as a connection. Similar to the above, the insulating substrate transition region 10 with a length of 0.2-0.5 mm is only a preferred choice in this e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a flexible printed circuit board (FPC), which comprises an insulating cover film layer, a conductive copper foil, an insulation substrate and a first reinforcing plate, wherein each layer is connected with and attached to one another through an adhesive, the conductive copper foil is etched with a zero insertion force (ZIF) splicing golden finger, one part of the first reinforcing plate extends in the upward direction and the downward direction respectively to form extended pins of the first reinforcing plate, and the distance from the extended pins of the first reinforcing plate to one end of the first reinforcing plate close to the ZIF splicing golden finger is equal to the splicing depth of the FPC. By applying the scheme of the flexible printed circuit board, the splicing positioning precision of the FPC can be improved, the conditions of being not in place and offset in the splicing process of the FPC are avoided, and the electric contact reliability of the FPC after splicing is improved.

Description

technical field [0001] The present invention relates to a printed circuit board (PCB, Printed Circuit Board) technology, in particular to a flexible printed circuit board (FPC, Flexible PCB). Background technique [0002] FPC has the characteristics of thin thickness, light weight, high density, bendability, and flexibility. It is widely used in the electronic field and can greatly reduce the volume of electronic products. There are three commonly used connection methods for FPC: Bonding by Anisotropic Conductive Film, Bonding by Soldering, and Connecting with ZIF (Zero Insertion Force) connectors. Among them, the plug-in method of connecting the ZIF connector has the advantages of convenient plug-in and disassembly, and is welcomed by various application manufacturers. [0003] Figure 1(a) is a schematic diagram of the front structure of an FPC with a ZIF plug-in gold finger. In this article, the side of the FPC with a ZIF plug-in gold finger is described as the front side...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/02H05K1/11
Inventor 宋成志
Owner 深圳市合力泰光电有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap