43results about How to "Improve electrical contact reliability" patented technology

The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

[Means for Solution] A solid oxide fuel cell apparatus including a fuel cell having a plate-shaped first solid electrolyte, an anode provided on one side of the first solid electrolyte and coming in contact with fuel gas, and a cathode provided on the other side of the first solid electrolyte and coming in contact with oxidizer gas. The solid oxide fuel cell apparatus further includes a cell-follow-up deformation member located on at least one of opposite sides of the fuel cell with respect to a first stacking direction along which the anode, the first solid electrolyte, and the cathode are stacked together. The cell-follow-up deformation member deforms according to a deformation of the fuel cell on the basis of at least one of physical quantities including differential thermal expansion coefficient and differential pressure.

The invention is concerned with the manufacture method of the ditch groove power semiconductor device. It is: provides the materials of the basal; forms the first electric transmit epitaxy layer on the basal; forms the second electric transmit zone and the ditch groove inside the epitaxy layer; forms the ebb first electric transmit area and the medium layer with the ditch groove; and then, forms the electric transmit area within the medium layer; forms the first electric transmit source area on the surface of the second electric transmit area; forms the second electric transmit contact area with higher doping PH indicator on the second electric transmit zone surface; forms the passivation layer cap on the top of the ditch groove which must with the medium layer and the electric transmit area; forms the diffusion protecting layer on the surface of the source area and the contact area; finally, forms the structure surface with good electric connection. The invention can control the threshold voltage of the device and improves the breakdown strength of the oxide layer of the device bottom area, and improves its electric connection reliability with no extra cover film printing plate and complex method request.

The invention discloses a flexible printed circuit board (FPC), which comprises an insulating cover film layer, a conductive copper foil, an insulation substrate and a first reinforcing plate, wherein each layer is connected with and attached to one another through an adhesive, the conductive copper foil is etched with a zero insertion force (ZIF) splicing golden finger, one part of the first reinforcing plate extends in the upward direction and the downward direction respectively to form extended pins of the first reinforcing plate, and the distance from the extended pins of the first reinforcing plate to one end of the first reinforcing plate close to the ZIF splicing golden finger is equal to the splicing depth of the FPC. By applying the scheme of the flexible printed circuit board, the splicing positioning precision of the FPC can be improved, the conditions of being not in place and offset in the splicing process of the FPC are avoided, and the electric contact reliability of the FPC after splicing is improved.

An electronic circuit that needs to transmit or receive radio waves achieves that goal by using an antenna. This disclosure teaches an antenna that can be mounted on an edge of a circuit board. This disclosure teaches antenna shapes that, when mounted on an edge of a circuit board, can advantageously make contact with circuits on both sides of the board. Some antenna shapes have protruding portions with springiness that facilitates affixing the antenna to the board and facilitates reliable electrical contacts with the circuits. The disclosure also teaches methods for mounting an antenna on an edge of a circuit board.

An aluminum enclosure of an electronic device is used in a corrosion environment. A long-term low impedance ground connection is needed because of security and EMC reasons. While common surface protection for aluminum in corrosion environments as for example polyurethane paint is not conductive, a stainless steel connector is provided which comprises a head portion and a bolt portion. The bolt portion is inserted into a bore of the enclosure or frame. An annular rib provided on the back side of the head portion defines a cutting edge which cuts into the surface of the aluminum enclosure and provides a gas-tight electrical contact. The front surface of the stainless steel head of the electrical connector element provides a metallic surface for connecting ground wires or other conductors.

The invention discloses an electric connector comprising an insulating body and multiple terminals. Each of the multiple terminals is provided with a first metal layer and a second metal layer which is arranged on the bottom side of the first metal layer, and the first metal layer is provided with a first electric contact, the second metal layer is provided with a second electric contact and the first electric contact and the second electric contact are arranged in a way of being suitable for simultaneously contacting the corresponding matching terminals. According to the electric connector, each terminal is provided with two metal layers which are vertically laminated so that the conductive area of the whole terminal can be increased, the resistance of the whole terminal can be reduced, the current transmission capacity of the terminal can be enhanced and thus high current can be transmitted. Besides, the two metal layers of each terminal are provided with the electric contacts contacted with the matching terminals of an external circuit so that the two metal layers of each terminal can be electrically contacted with the matching terminals simultaneously, the contact impedance of the terminals can be reduced and the electric contact reliability of the terminals can be enhanced.

The present invention provides a medical electrode, which comprises an annular adhesive pad (203) to be attached to a living being, a conductive pad (205) disposed in the central hole (207) of the annular adhesive pad, a first conductive snap element (209), a conductive element (211) and a sealing film (213). The conductive element (211) is configured to establish electrical communication between the conductive pad (205) and the first conductive snap element (209) and the sealing film (213) is attached to the annular adhesive pad (203) and to fix at least a portion of the conductive element (211) between the annular adhesive pad (203) and the sealing film (213). The flexibility and/or length of the conductive element is chosen to be large enough so as to allow the first conductive snap element (209) to move without causing the conductive pad (205) to move, resulting in reliable electrical contact between the conductive pad and the skin of the living being.

To provide a prober and a probe contact method capable of enhancing the reliability of electrical contact between electrode pads on a wafer and probes. A prober includes a wafer chuck, a probe card, a ring-shaped seal member provided on the wafer chuck, a Z-axis moving/rotating unit which lifts up and down the wafer chuck detachably fixed to a wafer chuck fixing part, a decompressor which depressurize an internal space formed by the probe card, the wafer chuck and the ring-shaped seal member, a lifting controller which controls the Z-axis moving/rotating unit to bring probes into contact with electrode pads in an overdrive condition, and a depressurization controller which controls the decompressor such that the wafer chuck is drawn to the probe card by depressurization of the internal space.

The semiconductor device comprises an interconnection buried in an interconnection groove formed in a lower insulating film, and an upper insulating film having a contact hole formed down to an end part of the interconnection. The interconnection groove is formed by using a design pattern having a main interconnection portion 100 and an extended portion 104 provided at an end part of a main interconnection portion 100 for forming the interconnection and extended perpendicularly to an extending direction of the main interconnection portion 100.

The disclosed switch paralleled with a vacuum arc-extinguishing room comprises: a fixed and circular-tube movable contact vertical arranged in an insulation cover as the main loop, and a vacuum arc-extinguishing room as the auxiliary loop, wherein using both an arc striking Z-arm connected with a separation brake spring and an over-travel spring to drive the contacts and form assist loop electric connection. This invention has high contact and running reliability, and reduces size and cost.

A method for manufacturing a metal component includes the steps of forming a resist film on a surface of an electrode plate, making the resist film exposed to light by use of a photomask having a mask pattern, in at least part of a rim of which a fine concavity and convexity are drawn, developing the resist film, to form an opening for molding in the resist film, and epositing an electroforming material by electroforming inside the opening for molding, to mold the material.

A contact pad configured to sense the voltage of a cell module assembly including at least one battery cell, is electrically connected to a voltage sensing module for measuring the voltage of the battery cell in the cell module assembly and electrically contacted with an electrode of the battery cell, and is made of a conductive organic elastomer, thereby improving reliability of electrical contact with each battery cell, and effectively preventing malfunction of the cell module assembly caused by impurities, external physical shocks and so on.

The invention discloses an electrical contact piece with an elastic double-helix winding contact element. The elastic double-helix winding contact element includes a support piece and a plurality of wire-shaped conductive pieces; the support piece is bent in a spiral shape, and the support piece The outer circumference is provided with a plurality of winding slots, and the plurality of winding slots are spirally arranged on the outer circumference of the support member in parallel with each other, and the two ends of each winding slot extend to the two ends of the support member respectively; each conductive member is wound along a single winding slot on the outer periphery of the support member, and the plurality of conductive members can be connected to each other. The invention improves the structural stability of the elastic contact element through the combination of the spiral winding and the spiral support, thereby ensuring the reliability of the electrical connection of the elastic contact element and the electrical contact element to which it is applied, and has a longer service life. The double-helix elastic winding contact element itself has better elasticity and improved contact performance, and can be applied to various occasions with different electrical connection intervals.

The invention deals with a support for light source(s) for a light module, notably for a motor vehicle, comprising a substrate; at least one surface light source of the organic light-emitting diode type supported by the substrate, the at least one surface light source comprising, at one or more edges, at least two electrical contact zones; electrical tracks deposited on the substrate; and electrical contacts between the electrical contact zones of the light source or sources and the electrical tracks. The electrical contacts comprise elastic blades, in contact under pressure with the contact zone or zones of the surface light source or sources and with the electrical tracks on the substrate.

The present invention discloses a connector. The connector comprises: an external conductor comprising a first external conductor and a second external conductor which are slidingly assembled, wherein the first external conductor comprises at least one electric contact pin used for electric contact with one first electronic part; a center conductor arranged in the external conductor and comprising a first center conductor and a second conductor which are slidingly assembled; an insulation base formed on the first external conductor in an insertion molding mode, wherein the at least one electric contact pin is exposed out of the surface of the insulation base; and a first elastic element located at the outer side of the at least part of the external conductor, having one end abutted against the insulation base, being suitable for applying an axial thrust to the first external conductor to allow the electric contact pins of the first external conductor to be reliably in electric contact with the first electronic part so as to improve the electric contact performance of the connector.