Laminated tape for packaging material

A technology for packaging materials and substrates, applied in the field of laminated tapes, can solve the problems of reduced peelability, reduced installation rate, inability to absorb, etc., to achieve the effects of suppressing influence, high installation rate, and maintaining anti-static properties

Inactive Publication Date: 2010-03-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a cover tape, a large amount of tackifier is mixed in the adhesive to ensure the adhesiveness to the backing paper of the carrier tape, so the adhesive force is larger than the appropriate value, and the peelability decreases with time, causing paper quality. The peeling of paper fibers on the surface of the packaging substrate (generating fluff) sometimes causes poor installation, and a cover tape that does not have these problems is desired
[0009] In addition, due to the peeling vibration (chattering) generated when the cover tape is peeled off from the paper packaging base material, the chip part in the cavity of the carrier tape backing paper tilts or flies out of the cavity (chip flying out), etc., by When the air suction nozzle picks up chip parts, it cannot pick up at the correct position, resulting in a decrease in the mounting rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] In a 2-shaft kneader, 80 parts by weight of ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd.: trade name "Mirason MV0603") as a base polymer, 20 parts by weight of ethylene- α-olefin copolymer, 10 parts by weight of alicyclic petroleum resin (produced by Arakawa Chemical Industry Co., Ltd.: trade name "Alcon P-125"), 5 parts by weight of polymer type antistatic agent containing polyether structure (three Produced by Photochemical Industry Co., Ltd.: trade name "Sanconol-L TBX-310") to prepare a melt. On a support base material (polyester film with a thickness of 25 μm), a film made of low-density polyethylene (LDPE) (manufactured by Mitsui Petrochemical Co., Ltd.: trade name "Mirason 16P") was placed by extrusion lamination. An intermediate layer with a thickness of 15 μm, on which the above-mentioned melt is melt-extruded to provide a thermal adhesive layer, and made to a thickness of 20 μm, thereby obtaining a laminated tape compo...

Embodiment 2

[0058] In a 2-shaft kneader, 100 parts by weight of ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd.: trade name "Mirason MV0603") as a base polymer, 15 parts by weight of alicyclic Petroleum resin (produced by Arakawa Chemical Industry Co., Ltd.: trade name "Alcon P-125"), 1 part by weight of polyether ester amide (produced by Sanyo Chemical Industry Co., Ltd.: trade name " Pelesstat 230"), 1 part by weight of a low-molecular antistatic agent (manufactured by Kao Corporation: trade name "TS-3B") to prepare a melt. On a support base material (polyester film with a thickness of 25 μm), a film made of low-density polyethylene (LDPE) (manufactured by Mitsui Petrochemical Co., Ltd.: trade name "Mirason 16P") was placed by extrusion lamination. An intermediate layer with a thickness of 15 μm, on which the above-mentioned melt is melt-extruded to provide a thermal adhesive layer, and made to a thickness of 20 μm, thereby obtaining a laminated ta...

Embodiment 3

[0060] In a 2-shaft kneader, 70 parts by weight of ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd.: trade name "Mirason MV0603") as a base polymer, 30 parts by weight of ethylene- α-olefin copolymer, 5 parts by weight of alicyclic petroleum resin (produced by Arakawa Chemical Industry Co., Ltd.: trade name "Alcon P-125"), 20 parts by weight of polyether ester amide ( Sanyo Chemical Industry Co., Ltd.: trade name "Pelestat 230") to prepare a melt. On a support base material (polyester film with a thickness of 25 μm), a film made of low-density polyethylene (LDPE) (manufactured by Mitsui Petrochemical Co., Ltd.: trade name "Mirason 16P") was placed by extrusion lamination. An intermediate layer with a thickness of 15 μm, on which the above-mentioned melt is melt-extruded to provide a thermal adhesive layer, and made to a thickness of 20 μm, thereby obtaining a laminated tape composed of a support substrate, an intermediate layer, and a ther...

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Abstract

The invention provides a laminated tape for packaging materials to ensure excellent adhesiveness to a packaging material such as a carrier tape, releasing property, and antistaticity and to be released without raising paper fabric of the surface layer of a paper packaging base material when the tape is released. The laminated tape for packaging materials is formed by pressing a layer of thermal adhesive which contains base polymer, polyolefin based resin and polymer based antistatic agent on a layer of support base material, wherein in 100 weight parts of base polymer, there is 1 to 20 parts of polyolefin based resin and 1 to 30 parts of polymer based antistatic agent. The polymer based antistatic agent is the polymer based antistatic agent with polyether structure. In the base polymer ofthe thermal adhesive, the base polymer contains 50% or less ethane-alpha-olefin copolymer.

Description

[0001] This application is a divisional application of the application with the filing date of May 19, 2006, the application number of 200610080605.1, and the title of the invention "laminated tape for packaging materials". technical field [0002] The present invention relates to a laminated tape used as a packaging material for packaging chip-type electronic components and the like at the time of conveyance and the like. Background technique [0003] As a method of conveying chip components, there is known a tape winding reel system in which the electronic components are packaged in a packaging material and conveyed. In this tape winding reel method, the parts are inserted on the carrier tape (paper packaging base material) provided with chip-type parts storage bags at regular intervals in the longitudinal direction of the tape-shaped cardboard, and the cover tape is heat-sealed from above. (Top tape) and sealed, rolled into a roll shape and transported. After transportat...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C09J7/02C09J123/00C09J11/08C09J9/00B65D73/02
CPCY02W90/10
Inventor花井启臣
OwnerNITTO DENKO CORP