LED package module

Abstract

The invention relates to a lighting LED package, which comprises a substrate and an LED chip, wherein the substrate is provided with a die bonding surface and a wiring surface. The package is characterized in that: the wiring surface is provided with a circuit part and an insulating part, wherein the circuit part forms a circuit on the substrate; the circuit part and the insulating part form a surface layer of the wiring surface; and the LED chip is arranged on the die bonding surface. The LED package module also comprises an energy transduction layer, wherein the energy transduction layer isarranged on the wiring surface and covers a part outside the wiring part and the insulating part; and the energy transduction layer consists of a mixture of heat-conductive insulating glue TiO2 and nanometer SnO2. The invention provides the LED package module with high positive heat dissipation efficiency.

Description

technical field [0001] The invention relates to an LED package for lighting. Background technique [0002] Compared with traditional lighting devices, LED street lights not only have the characteristics of good chromaticity, maintenance-free, and long life, but more importantly, they are more energy-efficient than traditional street lights. [0003] Chinese invention patent documents CN101101103, CN101101102, and CN101101107 respectively disclose a LED street lamp, the heat dissipation performance of which has reached a practical level. The above three kinds of LED street lamps represent the mainstream of LED lighting technology on the market, including tunnel lights and indoor lighting, and their core technologies are very similar to those disclosed in the above patent documents. The above-mentioned technologies all use an aluminum substrate with a printed circuit, set a plurality of single LED bulbs on the aluminum substrate, and then attach a radiator to the back of the ...

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned existing technologies still have deficiencies, which restrict the popularization and application of LED lighting technology.

The heat dissipation effect of the above-mentioned prior art is still not very satisfactory. The heat dissipation method of the existing LED lighting devices is to emit light from the front and dissipate heat from the back; The bottom is made of materials with low thermal conductivity such as sapphire, and the main heat is dissipated from the front or side, which is in contradiction with the heat dissipation on the back of the LED lighting device. device failure

Images