Method for automatically monitoring peripheral deburring and flaw of silicon slice by using optical microscope

Abstract

The invention discloses a method for automatically monitoring peripheral deburring and flaw by using an optical microscope, which comprises the following steps: 1, selecting a silicon slice, and scanning by an automatic detection instrument to generate an original data file; 2, editing the original data file by system software; adding virtual chips in an invalid chip area at the edge of the silicon slice beyond the scanning range of the automatic detection instrument, and editing virtual flaws on the added virtual chip to generate a data result file; 3, transmitting the data result file to theoptical microscope by the system software, and automatically photographing the surfaces of chips including the chips in the invalid chip area at the edge of the silicon slice by the optical microscope according to the data result file; and 4, analyzing the deburring and flaw condition of the periphery of the silicon slice by the system software according to photos. By adopting the method, the deburring and flaw condition of the edge of the silicon slice can be automatically affirmed.

Description

technical field [0001] The invention relates to a semiconductor detection technology, in particular to a method for automatically detecting edge removal and defects around a silicon wafer with an optical microscope. Background technique [0002] The optical microscope used in semiconductor inspection can accurately confirm defect points through origin alignment, can switch between different magnifications, can classify and distinguish different defects, and can take pictures of required defects and save them. Look at the photos taken through the system software and analyze and confirm. [0003] At present, semiconductor manufacturing plants use optical microscopes to detect silicon wafers. Usually, the silicon wafers are first scanned by an automatic inspection instrument to obtain the original data files on the surface of the silicon wafers, and then the original data files are transmitted to the optical microscope through the system software. Adjust the optical microscope...

AI Technical Summary

Problems solved by technology

[0004] But the automatic inspection instrument scans the silicon wafer and can only usually obtain the data of the valid wafer (chip with complete pattern) of the silicon wafer, but cannot obtain the invalid wafer (the wafer without complete pattern (chip)) distributed on the edge of the silicon wafer. chip)) data, so it is impossible to automatically detect the edge removal and defects around the silicon wafer

Usually, the edge removal and defects of the silicon wafer are confirmed manually on the machine, which consumes a lot of manpower and material resources, which not only affects the work efficiency, but also has poor confirmation accuracy and cannot be realized. Carry out long-term and standardized monitoring of the peripheral edge removal and peripheral defects of silicon wafers in a process of online products

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