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Printed circuit board (PCB) packaging structure and manufacturing method thereof

A printed circuit board and printed circuit technology, which is applied to printed circuit components, printed circuits assembled with electrical components, printed circuits connected with non-printed electrical components, etc., can solve the problem of low product yield and low product reliability, etc. problems, to achieve the effect of improving product yield and reliability, improving welding product reliability and product yield

Active Publication Date: 2010-05-26
DONGGUAN HAOYUAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of the problems of low product reliability and low product yield in the prior art printed circuit board packaging structure, it is necessary to provide a printed circuit board packaging structure with high product reliability and high product yield

Method used

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  • Printed circuit board (PCB) packaging structure and manufacturing method thereof
  • Printed circuit board (PCB) packaging structure and manufacturing method thereof
  • Printed circuit board (PCB) packaging structure and manufacturing method thereof

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Embodiment Construction

[0023] The structure and manufacturing method of the printed circuit board packaging structure of the present invention will be described below with reference to the accompanying drawings.

[0024] see figure 2 , which is a schematic diagram of the side structure of the printed circuit board packaging structure of the present invention. The printed circuit board packaging structure 2 is an electronic component used to realize the transmission of control signals and data signals, such as the electrical connection between signal sources and application terminal products, and can also be used to realize other wire functions. The printed circuit board packaging structure 2 includes a printed circuit board 21 , a ground pad 23 and an intermediate layer 25 . The printed circuit board 21 and the ground pad 23 are stacked and spaced apart, the intermediate layer 25 is sandwiched between the printed circuit board 21 and the ground pad 23, and the printed circuit board 21 and the grou...

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Abstract

The invention provides a printed circuit board (PCB) packaging structure which comprises a grounding gasket, a PCB and a middle layer, wherein the middle layer is clamped between the grounding gasket and the PCB, and the relative positions of the grounding gasket and the PCB are fixed by the middle layer; and the middle layer is a good heat conductor and provides quick heat exchange between the grounding gasket and the PCB. The PCB packaging structure of the invention can improve the reliability and the manufacturing yield of products. Meanwhile, the invention also provides a manufacturing method of the PCB packaging structure.

Description

technical field [0001] The invention relates to a packaging structure and a manufacturing method thereof, in particular to a packaging structure of a printed circuit board and a manufacturing method thereof. Background technique [0002] In electronic products and related industries, various electronic components need to be electrically connected to transmit power signals, data signals, etc. Therefore, the packaging of the circuit board used to realize the conduction of various electronic components is very important. In today's electronic packaging technology, it is necessary to couple various electronic components, such as amplifiers, analog-to-digital conversion units, semiconductor chips, circuitized substrates, etc., to a printed circuit board, and gradually improve the circuit design of these electronic components. density. However, the increase in density forces more heat energy generated by each electronic component to be effectively exchanged during operation. Thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H05K3/30H05K7/20
Inventor 冉彦祥李叶飞黄玮
Owner DONGGUAN HAOYUAN ELECTRONICS CO LTD
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