Heat dissipation device and electronic equipment

Abstract

The invention discloses a heat dissipation device used for electronic equipment. The heat dissipation device comprises a first heat sink, a second heat sink and a heat transfer connection piece, wherein the first heat sink is used for being in closely contact with a heat generation component of the electronic equipment, the second heat sink is used for being arranged with the heat generation component in a staggered way, and the heat transfer connection piece is arranged between the first heat sink and the second heat sink and is connected with the first heat sink and the second heat sink. In the heat dissipation device, the first heat sink can be used for directly dissipating heat of the heat generation component, the heat can be also transferred to the second heat dissipation component far away from the heat generation component by the heat transfer connection piece and is dissipated, so that the heat of the heat generation component is fully and effectively dissipated, the frequency of the electronic equipment is prevented from being reduced, the performance of the electronic equipment can be fully developed, a local temperature of a position, corresponding to the heat generation component, on the electronic equipment is also prevented from being excessively high, and a user is convenient to wear the electronic equipment. The invention also provides the electronic equipment employing the heat dissipation device. The performance of the electronic equipment can be developed to the greatest extent, no problem of excessively high local temperature is generated, and the user is convenient to wear.

Description

technical field [0001] The present invention relates to the technical field of machinery industry, more specifically, to a heat dissipation device, and also to an electronic device using the above heat dissipation device. Background technique [0002] With the development of society, electronic devices are more and more used in people's production and life. [0003] There are various types of electronic devices, among which the bendable electronic device can be directly worn by a user in a bent state. Since the above-mentioned electronic device is in contact with the user's skin for a long time when worn, the local temperature at the position corresponding to the heating element in the electronic device cannot be too high, so as not to damage the user's skin. At present, electronic equipment avoids excessive heat dissipation of heating elements by reducing frequency and performance, and prevents local high temperature of electronic equipment. However, this method causes the...

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Problems solved by technology

At present, electronic equipment avoids excessive heat dissipation of heating elements by reducing frequency and performance, and prevents local high t...

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