Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects

Abstract

Various computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects are provided. One computer-implemented method for determining if actual defects are potentially systematic defects or potentially random defects includes comparing a number of actual defects in a group to a number of randomly generated defects in a group. The actual defects are detected on a wafer. A portion of a design on the wafer proximate a location of each of the actual defects in the group and each of the randomly generated defects in the group is substantially the same. The method also includes determining if the actual defects in the group are potentially systematic defects or potentially random defects based on results of the comparing step.

Description

technical field [0001] The present invention relates generally to a computer-implemented method of determining whether an actual defect is a potential systematic defect or a potentially random defect. Certain embodiments relate to determining whether an actual defect is a potential systematic defect or a potential random defect by comparing the actual defects grouped by design with the randomly generated defects grouped by design. Background technique [0002] The following description and examples are not admitted to be prior art by virtue of their inclusion in this section. [0003] Integrated circuit (IC) designs may be developed using methods or systems such as electronic design automation (EDA), computer aided design (CAD), and other IC design software. Such methods and systems can also be used to generate circuit pattern databases from IC designs. The circuit pattern database includes data representing multiple layouts for the various layers of the IC. The data in t...

AI Technical Summary

Problems solved by technology

Furthermore, with minor design rules, process-induced failures may in some cases tend to be systematic

That is, process-induced failures tend to fail in predetermined design patterns that are typically repeated many times within the design

Additionally, while defects are generally process and design interrelated, process-induced failures are defects that arise from process variation phenomena that are not necessarily due to poor design

Therefore, these previously used methods may produce erroneous results by identifying groups of random defects as potentially systematic defects

Additionally, methods based on Pareto chart cut-lines may not be effective for determining which defect bins contain potentially systematic defects, since all defects on a given wafer are assumed to be random defects (i.e., assuming 0% systematic), the defect counts shown in the Pareto chart illustrating the results of grouping by design may only report the relative area of ​​the different circuit structures on that wafer

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