Ceramic dielectric material matched with nickel inner electrode

A technology of dielectric materials and ceramic dielectrics, applied in fixed capacitor dielectrics, components of fixed capacitors, laminated capacitors, etc., can solve the problem of high production cost, achieve good matching, uniform particles, and save production costs.

Active Publication Date: 2010-12-15
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dielectric constant of MLCC products is in the range of 20 to 40, and the frequency characteristics and dielectric properties are excellent, but the firing temperature of this MLCC product is 1250 ° C to 1350 ° C, resulting in high production costs

Method used

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  • Ceramic dielectric material matched with nickel inner electrode
  • Ceramic dielectric material matched with nickel inner electrode
  • Ceramic dielectric material matched with nickel inner electrode

Examples

Experimental program
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Embodiment

[0011] A low-temperature and high-frequency ceramic dielectric material matched with nickel electrodes, the main crystal phase is Mg 0.05 Ca 0.6 Sr 0.35 Ti 0.13 Zr 0.87 o 3 s material. Then add the modifying additives and sintering aids shown in Table 1 in predetermined proportions.

[0012] Table 1: Formulation composition of main crystal phase, modifying additives, and sintering flux

[0013]

[0014]

[0015] Next, make MLCC ceramic materials according to the production process of ceramic materials commonly used by those skilled in the art. In the production process of chip MLCC, first add organic binders and solvents such as ethanol to form a slurry, and cast the slurry It is made into a thin film, and nickel Ni internal electrodes are printed on the diaphragm, and the required layers are alternately laminated to form a green MLCC chip, and then the green MLCC chip is heat-treated at a temperature of 200-400 ° C to remove organic binders and solvents. The MLCC...

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PUM

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Abstract

The invention discloses a low-temperature high-frequency ceramic dielectric material matched with a nickel electrode, which consists of a main crystal phase, a property-modifying additive and a sintering fluxing medium. The structural formula of the main crystal phase is (MgaCabSr(1-a-b))nTicZr(1-c)O3, wherein a is more than or equal to 0 and less than or equal to 0.15; b is more than or equal to0 and less than or equal to 1; c is more than or equal to 0 and less than or equal to 0.15; and m is more than or equal to 0.8 and less than or equal to 1.1. The property-modifying additive is one ormore MnO2, Al2O3, CaO and Y2O3. The sintering fluxing medium is one or more SiO2, ZnO, Li2O, K2O and BaO. The material meets EIA standard COG characteristics, and has material uniformity, uniform size distribution, high dispersibility, good molding process and high dielectric properties. When used for manufacturing a multi-layer chip ceramic capacitor, the material is matched with the nickel electrode, and after being sintered, ceramic crystal grains uniformly and compactly grow and a dielectric layer is well matched with the inner electrode, so stress generation is reduced, a Q value of the product is increased and the performance of the product is more stable.

Description

technical field [0001] The invention relates to a ceramic dielectric material and a preparation method of the obtained components, in particular to a ceramic material conforming to COG characteristics, which can be sintered in a reducing atmosphere, and can be matched with a nickel inner electrode. A high-frequency low-dielectric ceramic dielectric material and the preparation of MLCC Products, especially suitable for the production of small size MLCC. Background technique [0002] With the penetration and expansion of electronic information technology in various technical fields, chip multilayer ceramic capacitors (MLCC for short), as an important electronic component, have always maintained the same high-level development speed as large-scale integrated circuits. The current development trend of MLCC technology is miniaturization, low voltage and large capacity, chip type, high voltage serialization, and base metalization of internal electrodes. Among them, the large-scale...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/49C04B35/48C04B35/64H01G4/12H01G4/30
Inventor 莫方策宋永生陈长云安可荣王孝国宋蓓蓓郭精华刘新李筱瑜黄旭业
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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