Unlock instant, AI-driven research and patent intelligence for your innovation.

Radiating device and fastener thereof

A technology of a heat sink and a fastener, applied in the field of heat sinks, can solve the problems of inability to fix the heat sink and many arrangement of electronic components, etc.

Inactive Publication Date: 2010-12-22
FU ZHUN PRECISION IND SHENZHEN +1
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the circuit boards in some highly integrated electronic devices are densely arranged with many electronic components. Therefore, there is no extra space to open holes or install fixed structures on the circuit boards, and the heat sink cannot be fixed by conventional fasteners. to heat-generating electronic components

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiating device and fastener thereof
  • Radiating device and fastener thereof
  • Radiating device and fastener thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Hereinafter, the heat dissipation device of the technical solution will be described in detail with reference to the drawings and embodiments.

[0015] refer to Figures 1 to 3 , a heat dissipation device according to an embodiment of the present invention, which includes a heat sink 10 and two fasteners 20 for fixing the heat sink 10 to a circuit board 30 .

[0016] A plurality of heating electronic components 32 are mounted on the circuit board 30 , and the heating electronic components 32 are spaced from each other and arranged along a straight line.

[0017] The radiator 10 is integrally formed by high thermal conductivity materials such as copper, aluminum or alloys thereof. The heat sink 10 includes a base plate 12 for contacting the heating electronic components 32 and a plurality of cooling fins 14 vertically extending from the top surface of the base plate 12 . The heat sinks 14 are spaced apart from each other and parallel to two opposite edges of the substr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a radiating device, used for radiating on a heating electronic element when being mounted on a circuit board. The radiating device comprises a radiator and at least one fastener; wherein the fastener comprises a first fastening piece, a second fastening piece and an operating piece; the radiator and the circuit board are arranged between the first fastening piece and the second fastening piece, the first fastening piece is pivoted with the second fastening piece at one end closed to the first fastening piece, one end of the first fastening piece is extended out from one side of the radiator and is pivoted with the operating piece, the operating piece is against on the second fastening piece, and the operating piece can rotate relative to the first fastening piece, so as to drive the second fastening piece to rotate relative to the first fastening piece, thus clamping the radiator and the circuit board. The fastener can be inserted from one side of the circuit board, so that the radiator is clamped on the heating electronic element on the circuit board and no hole through which the fastener can penetrate is required to be opened on the circuit.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a buckle. Background technique [0002] Nowadays, in the computer industry, in order to effectively dissipate the heat generated by heat-generating electronic components such as micro-processing chips, the usual method is to attach the heat sink closely to the heat-spreading surface of the heat-generating electronic components to assist the heat-generating electronic components to dissipate heat. Keep heat-generating electronic components operating at proper temperatures. [0003] In order to attach the heat sink closely to the heat-spreading surface of the heat-generating electronic component, the industry usually uses a fastener to fix the heat-sink to the circuit board where the heat-generating electronic component is located. The lower end of the buckle usually cooperates with a fixing structure installed on the circuit board or passes downward thro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K7/12H01L23/40G06F1/20
CPCH05K7/20509
Inventor 赵品群郑东波符猛陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com