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Vacuum interlocking chamber with in-built adapter unit

A transfer unit, built-in technology, applied in the field of vacuum interlock chambers, can solve problems such as time required for inspection, wrong adsorption of semiconductor wafer W, and long time required for switching operations

Active Publication Date: 2010-12-29
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the conventional vacuum interlock chamber 1, the loading unit 3 can switch between the wafer cassette C and the transfer unit 8, but there is a problem that when the wafer is automatically transferred, before the operator comes to the inspection device, the operator will place the wafer cassette C on the wafer. The wafer cassette loading mechanism of the setting part 3 is modified and set to the adapter unit 8, and the operator switches the program for the adapter unit, and various initial settings must be modified, and the switching operation between the wafer cassette C and the adapter unit 8 takes a long time.
In addition, since the adapter unit 8 has a structure in which the semiconductor wafer W is vacuum-adsorbed, there is a possibility that an adsorption error may occur on the semiconductor wafer W, and it takes time to inspect it.

Method used

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  • Vacuum interlocking chamber with in-built adapter unit
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Embodiment Construction

[0029] Below, according to Figure 1 to Figure 6 The illustrated embodiment describes a vacuum interlock chamber with a built-in adapter unit according to the present invention. In this embodiment, a vacuum interlock chamber with a built-in adapter unit (hereinafter, simply referred to as a "vacuum interlock chamber") is used for an inspection device for inspecting electrical characteristics of an object to be processed (for example, a semiconductor wafer). Be explained.

[0030] The vacuum interlock chamber 10 of the present embodiment, for example, figure 1 As shown in (a), it is provided adjacent to the processing chamber (detection chamber) 20 of the inspection apparatus 100 . This vacuum interlock chamber 10 includes: a wafer cassette loading unit 11 on which a wafer cassette C containing a plurality of semiconductor wafers W is placed; The first wafer transfer mechanism 12 that transfers the semiconductor wafer W; the buffer stage arrangement unit 13 that arranges th...

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Abstract

The invention provides a vacuum interlocking chamber with an in-built adapter unit. The vacuum interlocking chamber (10) comprises an adapter unit which is arranged corresponding to a rail guided vehicle(RGV) of automatically conveying semiconductor chips (W) on a buffering station configuration part (13) different with a chip box carrying part(11), and holds multiple semiconductor chips (W) to be conveyed between the RGV (40) and each detecting chamber (20). Thus, switching operation between the adapter unit and a container such as a chip box is not necessary as before, and non-automatic conveying and automatic conveying of an article to be detected are realized.

Description

technical field [0001] The present invention relates to a vacuum interlock chamber that is adjacent to a processing chamber that performs predetermined processing on a processing object such as a semiconductor wafer, and that transfers the processing object before and after processing between the processing chambers. More specifically, it can be switched in a short time Vacuum interlock chamber for non-automatic transfer of objects to be processed (transfer of wafer cassettes by the operator) and automatic transfer. Background technique [0002] In a semiconductor manufacturing plant, various processing devices are arranged in a clean room. The processing device is provided with a vacuum interlock chamber and a processing chamber adjacent to each other. It is used to transport the object to be processed from the vacuum interlock chamber to the processing chamber. It is constructed by returning from the processing chamber to the vacuum interlock chamber. Hereinafter, an ins...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/677
CPCH01L21/67259H01L21/67703H01L21/67706H01L21/67739H01L21/6776H01L21/68H01L21/683H01L22/12
Inventor 保坂广树秋山收司
Owner TOKYO ELECTRON LTD