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Heat dissipation device

A technology of heat dissipation device and heat dissipation pipe, which is applied to lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve the problems of decreasing heat dissipation effect and obstructing air circulation, and achieve the effect of improving heat dissipation effect.

Inactive Publication Date: 2011-01-12
常熟琦光光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking various high-power lamps (above 50W) as an example, people try to increase the area and number of heat sinks in order to enhance the heat dissipation effect. In the direction of the heat sink, the air is easy to circulate and can quickly take away heat. However, in the direction perpendicular to the heat sink, since the heat sink is generally wide, the circulation of the air is hindered, and the heat dissipation effect is greatly reduced. Therefore, in order to ensure heat dissipation effect, it is necessary to ensure smooth air circulation in all directions of the cooling device

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Set the mold parameters and manufacture 100 hollow cooling tubes with a screw structure at one end and a length of 10cm for use. Create 10*10 screw holes with an interval of 1cm on the hollow carrier plate, and put the heat transfer liquid into the hollow carrier The heat dissipation device of the present invention is manufactured by screwing the above-mentioned hollow heat dissipation tubes on the hollow carrier plate through the screw holes.

Embodiment 2

[0017] Set the mold parameters and manufacture 200 hollow cooling tubes with a screw structure at one end and a length of 10cm for use. Create 10*20 screw holes with an interval of 1cm on the hollow carrier plate, and put the heat transfer liquid into the hollow carrier The heat dissipation device of the present invention is manufactured by screwing the above-mentioned hollow heat dissipation tubes on the hollow carrier plate through the screw holes.

Embodiment 3

[0019] Set the mold parameters and manufacture 300 hollow cooling pipes with a screw structure at one end and a length of 5cm for use. Create 10*30 screw holes with an interval of 0.5cm on the hollow carrier plate, and put the heat transfer liquid into the hollow In the bearing plate, the above-mentioned hollow heat dissipation pipe is screwed on the hollow bearing plate through the screw hole to manufacture the heat dissipation device of the present invention.

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Abstract

The invention relates to a heat dissipation device, in particular to the heat dissipation device for high-power LED lamps. The device consists of a hollow bearing plate, a hollow heat dissipation tube and heat conducting liquid, wherein the heat conducting liquid is held in the hollow bearing plate; and the hollow heat dissipation tube is fixed on the hollow bearing plate through a screw structure. The integral device is fixed at a position needing heat dissipation; and the device contributes to the air circulation in each direction and has a good heat dissipation effect.

Description

technical field [0001] The invention relates to a heat dissipation device, which is mainly used for heat dissipation of high-power LED lamps and belongs to the field of semiconductor lighting. technical background [0002] At present, semiconductor lighting technology is developing very rapidly. Not only the market scale is expanding rapidly, but also technology is constantly improving. The lumen efficiency has exceeded 200lm / W. However, a major problem in the field of semiconductor lighting - heat dissipation has not been solved. The temperature of lamps and lanterns is generally higher. In order to ensure the application effect of lamps and lanterns, the method commonly used at present is to use a certain number of sheet radiators to conduct heat into the air. Taking various high-power lamps (above 50W) as an example, people try to increase the area and number of heat sinks in order to enhance the heat dissipation effect. In the direction of the heat sink, the air is eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/56
Inventor 王海波张瑞西刘光熙范供齐黄如喜
Owner 常熟琦光光电科技有限公司