Dimmer lighting assembly and manufacturing method thereof

[0043] The present invention discloses a light-changing light-emitting component, which has a wide range of applications. In order to make the description of the present invention more detailed and complete, please refer to the following description and cooperate Figure 1 to Figure 4 的图。 The drawings.

[0044] Please refer to figure 1 , Which is a schematic top view showing a variable light emitting component according to an embodiment of the present invention. In an embodiment, the variable light emitting assembly 100 mainly includes a bracket 108, at least two light emitting chips 110 and 112, and at least two independent power supplies 114 and 116. The independent power supplies 114 and 116 are respectively electrically connected to the corresponding light-emitting chips 110 and 112 to supply the required power.

[0045] In one embodiment, the bracket 108 includes a chip carrier 102 and at least two pairs of pins 104 and 106.

[0046] Please refer to figure 2 , Which is a cross-sectional view of a part of the device between the light-emitting chip and the chip carrier of a light-changing light-emitting assembly according to an embodiment of the present invention. In this embodiment, the chip carrier 102a of the bracket 108a has at least one groove 124. The groove 124 is formed in the surface 118a of the chip carrier 102a. The groove 124 is slightly larger than the size of the light-emitting chip 112.

[0047] In the light-changing light-emitting assembly 100, one light-emitting chip 110 is disposed on the surface 118a of the chip carrier 102a, and the other light-emitting chip 112 is disposed in the groove 124 of the chip carrier 102a.

[0048] The light emitting chip 112 further includes a conformal fluorescent paint layer 126. The conformal fluorescent paint layer 126 is covered on the entire light-emitting chip 112. Moreover, the conformal fluorescent paint layer 126 is filled in the groove 124 of the chip carrier 102a. Since the conformal fluorescent paint layer 126 of the light-emitting chip 112 is filled in the groove 124, the light emitted by the light-emitting chip 110 can be prevented from exciting the fluorescent powder in the conformal fluorescent paint layer 126 of the light-emitting chip 112, thereby preventing conformal The fluorescent paint layer 126 emits light due to accidental excitation.

[0049] In addition, such as figure 2 As shown, due to the existence of the groove 124, the phosphor paint layer 126 can be smoothly coated only on the light-emitting chip 112 in the groove 124 while keeping the light-emitting chip 110 uncoated with fluorescent paint.

[0050] In another example, another fluorescent paint can also be applied to the light-emitting chip 110 without affecting the fluorescent paint coating of the light-emitting chip 112. Therefore, through the use of the chip carrier 102a, the phosphor coating adjustment can be smoothly performed on the light-emitting chips 110 and 112 in the same light-changing light-emitting assembly 100.

[0051] Please refer to image 3 , Which is a partial cross-sectional view of the device between the light-emitting chip and the chip carrier of another light-changing light-emitting assembly according to an embodiment of the present invention. In this embodiment, the surface 118b of the chip carrier 102b of the bracket 108b is a planar structure. In the light-changing light-emitting assembly 100, the two light-emitting chips 110 and 112 are both arranged on the surface 118b of the chip carrier 102b, so the light-emitting chips 110 and 112 are arranged on the same plane. The light-emitting chip 112 further includes a conformal fluorescent paint layer 128, wherein the conformal fluorescent paint layer 128 is uniformly covered on the entire light-emitting chip 112.

[0052] Please refer to Figure 4 , Which is a cross-sectional view of a part of the device between the light-emitting chip and the chip carrier of a light-changing light-emitting assembly according to another embodiment of the present invention. In this embodiment, the surface 118 of the chip carrier 102c of the bracket 108c includes two flat surfaces 134 and 136, wherein there is a height difference between the two flat surfaces 134 and 136. In the dimmable light-emitting assembly 100, one of the light-emitting chips 110 is disposed on the plane 134 of the chip carrier 102c, and the other light-emitting chip 112 is disposed on the other plane 136 of the chip carrier 102c.

[0053] In an embodiment, the light-emitting chip 112 further includes a conformal fluorescent paint layer 130. The conformal fluorescent paint layer 130 is provided on the entire light emitting chip 112. Since the left and right sides of the chip carrier 102c are two planes 134 and 136 with a height difference, the light emitted by the light-emitting chip 110 can be prevented from exciting the phosphor in the conformal fluorescent coating layer 130 of the light-emitting chip 112, thereby preventing conformal The fluorescent paint layer 126 emits light due to accidental excitation.

[0054] In this embodiment, the bracket 108c can optionally be provided with a blocking structure 132. The two light-emitting chips 110 and 112 are respectively located on two sides of the blocking structure 132 to prevent the light emitted by the light-emitting chip 110 from exciting the phosphor in the conformal fluorescent paint layer 130 of the light-emitting chip 112 to emit light.

[0055] In addition, such as Figure 4 As shown, since the chip carrier 102c includes two flat surfaces 134 and 136 with a height difference, the phosphor coating layer 126 can be smoothly removed while keeping the light emitting chip 110 on the flat surface 134 uncoated with fluorescent paint. It is coated on the light emitting chip 112 arranged on the other plane 136.

[0056] In another example, another fluorescent paint can be applied to the light-emitting chip 110 without affecting the fluorescent paint coating of the light-emitting chip 112. Therefore, through the use of the chip carrier 102c, the phosphor coating adjustment can be smoothly performed on the light-emitting chips 110 and 112 in the same dimming light-emitting assembly 100.

[0057] In one embodiment, the light-emitting chips 110 and 112 may be photoelectric components such as general light-emitting diodes, high-power light-emitting diodes, or laser diodes.

[0058] The light-emitting chips 110 and 112 may have different light-emitting colors, for example, one is a white light-emitting chip, and the other is a blue, green or red light-emitting chip.

[0059] In one embodiment, both the light-emitting chips 110 and 112 may include a fluorescent paint layer (not shown in the figure), especially a conformal fluorescent paint layer, to provide uniform color light with a desired color.

[0060] In another embodiment, there may be only one light-emitting chip, such as the light-emitting chip 112, which includes a conformal fluorescent paint layer covering it. Of course, in a variable light emitting component 100, all the light emitting chips 112 may not have a fluorescent paint layer.

[0061] Please refer to Figure 5A to Figure 5C , Is a cross-sectional view showing a manufacturing process of a variable light emitting device according to an embodiment of the present invention. In one embodiment, a variable light emitting component is made, for example image 3 One or more light-emitting chips, such as light-emitting chips 110 and 112, may be provided in the shown light-changing light-emitting assembly. Then, like Figure 5A As shown, the light-emitting chips 110 and 112 are configured and fixed on the surface 118b of the supporting seat 102b of the bracket 108b.

[0062] Next, a shield 140 is provided, and the shield 140 is covered above the carrier 102b. Wherein, the shield 140 may have at least one opening 142. The opening 142 can expose the light-emitting chip 112 to be coated with the fluorescent paint below. However, the other light-emitting chip 110 is covered by the shield 140.

[0063] Next, the spraying device 144 is provided, and the spraying device 144 is arranged above the shield 140. Among them, the spraying device 144 may be equipped with a phosphor solution 146. In one embodiment, the phosphor solution 146 includes colloidal solvent, colloid and phosphor. The colloidal solvent may include, for example, xylene, n-heptane, or acetone. The colloid may include, for example, silica gel or epoxy resin.

[0064] In one embodiment, in the phosphor solution 146, the ratio of colloid solvent, colloid and phosphor powder may be about 50%, 20%, and 30%.

[0065] Next, the spraying device 144 is used to perform the spraying process. In an embodiment, please refer to Figure 5B During the spraying process, the spraying device 144 can be controlled to be above the opening 142 of the shield 140 and spray the phosphor solution 146 on the light-emitting chip 112 below it back and forth along the path 148. After the spraying process, the light emitting surface 152 and the side surface 154 of the light emitting chip 112 are conformally covered by the phosphor solution 146.

[0066] In one embodiment, such as Figure 5B As shown, while the spraying device 144 is used to spray the phosphor solution 146, the heating source 150 can be selectively used to perform a heating process to evaporate the colloidal solvent in the phosphor solution 146 covering the light-emitting chip 112.

[0067] Next, a curing process is performed to cure the phosphor solution 146 conformally coated on the surface of the light-emitting chip 112 into a conformal fluorescent paint layer 128 to complete the Figure 5C Fabrication of the variable light emitting assembly shown.

[0068] in figure 1 Among them, a pair of pins 104 are electrically connected to the n-type electrode and the p-type electrode of the light-emitting chip 110 through two wires 120, respectively. In addition, the pair of pins 106 are also electrically connected to the n-type electrode and the p-type electrode of the light-emitting chip 112 through the two wires 122. In addition, the two poles of the independent power supply 114 are electrically connected to the two pins 104 respectively, and the two poles of the independent power supply 116 are electrically connected to the two pins 106 respectively. Therefore, the light-emitting chip 110 can be electrically connected to the independent power source 114 through the wire 120 and the pin 104 sequentially, and the light-emitting chip 112 can be electrically connected to the independent power source 116 through the wire 122 and the pin 106 sequentially.

[0069] By electrically connecting the light-emitting chips 110 and 112 to the independent power supplies 114 and 116, respectively, the switching of the light-emitting chips 110 and 112 can be independently controlled by controlling the independent power supplies 114 and 116. Therefore, in one embodiment, in the same dimming light-emitting assembly, all light-emitting chips can be respectively connected to an independent power source, and can be turned on and off independently. Therefore, in a light-changing light-emitting assembly, all light-emitting chips or only part of the light-emitting chips can be lighted at the same time to achieve the effect of light-changing light.

[0070] In an embodiment, the light-changing light-emitting assembly 100 may also optionally include a switch 138. The switch 138 can respectively control the switches of the independent power supplies 114 and 116 in the dimming light-emitting assembly 100, and further control the on and off of all the light-emitting chips 110 and 112 in the dimming light-emitting assembly 100, thereby achieving the dimming effect.

[0071] It can be seen from the above-mentioned embodiments that one advantage of the present invention is that because each light-emitting chip in a variable light-emitting assembly has an independent power source, the switch of each light-emitting chip can be independently controlled, and the light can be switched at any time. The light-emitting color of the component can effectively expand the application of the light-emitting component.

[0072] It can be seen from the above embodiments that another advantage of the present invention is that the variable light emitting component does not use series-parallel circuits to connect all the light-emitting chips, and these light-emitting chips have independent power supplies, so that all the light-emitting chips cannot operate. Therefore, after some of the light-emitting chips are damaged, the other part of the light-emitting chips can still operate effectively and continue to provide light sources.

[0073] It can be seen from the above-mentioned embodiments that another advantage of the present invention is that the variable light-emitting component can provide light sources of multiple color systems in the same component, and can increase the diversity of light-emitting colors of the light-emitting component.

[0074] Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be subject to the scope defined by the claims.