Method for manufacturing light-variable light-emitting component

Abstract

The invention relates to a method for manufacturing a light-variable light-emitting component. The method comprises the steps of providing a light-emitting chip configured on a bearing base; providing a first shield with a first opening enabling the light-emitting chip to be exposed; providing a spraying device configured above the first shield to carry out a first spraying manufacturing procedure, wherein the spraying device sprays first fluorophor solutions back and forth along a first path, and one light emitting face and multiple side surfaces of the light-emitting chip are coated by the first fluorophor solutions conformally; carrying out a solidification manufacturing procedure to enable the first fluorophor solutions coating the surface of the light-emitting chip to be solidified to be a first conformal fluorescence coating layer.

Description

[0001] This application is a divisional application of a Chinese invention patent application with an application date of November 9, 2009, an application number of 200910211888.2, and an invention title of "Dimmable Light-emitting Component and Its Manufacturing Method". technical field [0002] The present invention relates to a manufacturing method of a light-emitting component, and in particular to a manufacturing method of a light-changing light-emitting component. Background technique [0003] When conventional light emitting diode chips (LED chips) are applied to light emitting component modules, a series-parallel structure circuit is used to connect these light emitting diode chips. [0004] However, with such a circuit structure design, when part of the LED chips are burned, the entire light-emitting component module cannot operate normally, which seriously affects the applicability of the light-emitting component module. Moreover, when part of the light emitting di...

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Problems solved by technology

[0004] However, with such a circuit structure design, when part of the light-emitting diode chips are burned, the entire light-emitting component module cannot operate normally, which seriously affects the applicability of the light-emitting component module.

Moreover, when part of the light emitting diode chips of the light emitting component module are burnt out, the light emitting component module can only be disassembled again, and the damaged light emitting diode chip in the light emitting component module can be replaced to make the light emitting component module operate smoothly and normally. It is labor-intensive and cost-intensive

Therefore, the circuit structure design of the traditional light-emitting component module is not economical

[0005] In addition, in the current phosphor powder coating technology, phosphor powder can only be coated on multiple or all LED chips in the same light-emitting component package at the same time, but cannot be used for each light-emitting diode chip located in the same light-emitting component package. Diode chips coated with different phosphors

[0006] Therefore, due to the limitation of phosphor powder coating technology, the application range of light-emitting component modules is limited

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