Surface mount structure and circuit board with same

Abstract

The invention provides a surface mount structure used for fixedly mounting an electronic element with a pin and a welding chassis onto a circuit board. The surface mount structure comprises a pad formed on the circuit board, wherein the pad comprises a first pad welded with the bottom surface of the pin, a second pad welded with the bottom surface of the welding chassis and a connecting wire for connecting the first pad and the second pad. The structure is characterized in that the area of the surface of the second pad, which is opposite to the bottom surface of the welding chassis, is larger than the area of the surface of the first pad, which is opposite to the bottom surface of the pin; the space between the first pad and the second pad is smaller than 0.3mm; the connecting wire comprises a current-limiting part and a non-current-limiting part; the current-limiting part is connected with the first pad, and the non-current-limiting part is connected with the second pad; and the partial or overall wire width of the current-limiting part is smaller than the wire width of the non-current-limiting part.

Description

technical field [0001] The invention relates to circuit board technology, in particular to a surface mount structure which can be used to mount electronic components and a circuit board with the surface mount structure. Background technique [0002] With the rapid development of the electronic industry, the manufacturing technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally made of a copper-clad substrate through a series of processes such as cutting, drilling, etching, exposure, development, pressing, and molding. For details, please refer to the article "Dielectric characterization of printed circuit board substrates" published by C.H.Steer et al. in Proceedings of the IEEE, Vol.39, No.2 (August 2002). [0003] Generally, after the circuit board is fabricated, various electronic components need to be mounted on the circuit board. Therefore, the surface of the circuit board ...

AI Technical Summary

Problems solved by technology

However, when the distance between a pad with a small surface area and a pad with a large surface area is short, that is, when the connection line is short (for example, less than 0.3mm), when the solder resist cannot be coated or printed, the above remelting The problem of solder flowing from pads with a smaller surface area to pads with a larger surface area still exists, which seriously affects the placement quality of electronic components

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