63results about How to "Improve placement quality" patented technology

Simultaneous Dynamical Integration modeling techniques are applied to global placement of elements of integrated circuits as described by netlists specifying interconnection of morphable-devices. Solutions to a system of coupled ordinary differential equations in accordance with Newtonian mechanics are approximated by numerical integration. A resultant time-evolving system of nodes moves through a continuous location space in continuous time, and is used to derive placements of the morphable-devices having one-to-one correspondences with the nodes. Nodes under the influence of net attractive forces, computed based on the interconnections between the morphable devices, tend to coalesce into well-organized topologies. Nodes are also affected by spreading forces determined by density fields that are developed based on local spatial node populations.

Simultaneous Dynamical Integration modeling techniques are applied to global placement of elements of integrated circuits as described by netlists specifying interconnection of morphable-devices. Solutions to a system of coupled ordinary differential equations in accordance with Newtonian mechanics are approximated by numerical integration. A resultant time-evolving system of nodes moves through a continuous location space in continuous time, and is used to derive placements of the morphable-devices having one-to-one correspondences with the nodes. Nodes under the influence of net attractive forces, computed based on the interconnections between the morphable devices, tend to coalesce into well-organized topologies. Nodes are also affected by spreading forces determined by density fields that are developed based on local spatial node populations.

The electronic component mounting line includes computing unit for calculating a print position of solder paste printed on board-side electrodes, electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to a displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

The invention provides a micro-reducing self-adjusting method used for a composite material laying orbit, and relates to the technical field of composite material laying moulding. The method has the characteristics as follows: error between a designed orbit and an ideal orbit is judged and calculated so as to adjust a two-step laying orbit slightly along a certain direction, namely, an orbit node with error is firstly adjusted to the ideal orbit slightly; and a reverse micro-adjustment is then carried out on a subsequent node correspondingly according to the micro-adjustment. The method can effectively eliminate error of the designed laying orbit; furthermore, the amount of calculation of the error process is not large.

A printed circuit board connector is equipped with a housing and plurality of contacts. The housing has an insertion chamber 11 inserted by the mating-side connector, and a plurality of contact-insertion holes inserted by the contacts. The contact has a base portion, a contact-connecting portion that connects with a mating-side contact, and a lead portion that is solder-bonded to the printed circuit board. The base portion and the housing have a contact lance and level that engage with each other so that the contact does not move in an insertion direction to the contact insertion hole or a reverse direction, and the contact lance and level swingably hold the base portion inside the contact-insertion hole so that the lead portion approaches and separates from the printed circuit board surface.

The invention provides a cement road formwork placement device. The cement road formwork placement device solves the problems that during construction, road formwork placement requires a lot of manpower, workers are prone to being scratched, placement is uneven, and the efficiency is low. According to the technical scheme, the cement road formwork placement device includes a machine frame, a flatplate is arranged in the machine frame, vertical plates are correspondingly arranged on the upper sides of the front and rear ends of the flat plate, long strip plates are arranged in the flat plate,long strip blocks are correspondingly arranged on the left and right side walls of the machine frame, a plurality of formworks are placed between the long strip plates and the long strip blocks, and grooves are formed at the ends, close to the flat plate, of the long strip blocks; and disks are arranged on the inner sides of side plates of the machine frame, connecting rods are hinged to the disks, horizontal plates are arranged at the lower ends of the disks, the disks, the connecting rods and the horizontal plates form a crank sliding block mechanism, and the horizontal plates and the long strip blocks are connected by a plurality of vertical jacking rods. The cement road formwork placement device is ingenious in structure and design, improves the efficiency of formwork placement in roadconstruction, effectively reduces manual labor amount, achieves even placement of the formworks, and improves the quality of the placement, meanwhile, the workers are prevented from being scratched,the applicability is wide, and the cement road formwork placement device is easy to promote.

The invention relates to a ratchet wheel transmission type dispensing system for SMT mounting. The ratchet wheel transmission type dispensing system for SMT mounting comprises a transmission mechanismand a plurality of dispensing mechanisms. The transmission mechanism comprises a driving motor and a circular workbench, and the circular workbench is mounted on the driving motor. The plurality of dispensing mechanisms are arranged around the periphery of the circular workbench. Each dispensing mechanism comprises a mounting beam, a lifting assembly, a dispensing assembly and a heating assembly,wherein the mounting beam is fixed on the ground and is provided with an accommodating groove, the accommodating groove is used for accommodating the periphery of the circular workbench, the liftingassembly is mounted on the mounting beam, and the dispensing assembly is mounted on the lifting assembly. The ratchet wheel transmission type dispensing system for SMT mounting can improve SMT mounting quality.

A large deformation flexible compression device for automatic fiber placement comprises a compression roller gum cover, a compression roller and a compression roller shaft, wherein the compression roller gum cover sleeves the compression roller, the compression roller is installed on the compression roller shaft, the compression roller can freely rotate so as to drive the compression roller gum cover to rotate around the compression roller shaft, and two ends of the compression roller gum cover are provided with hollow structures. In the filter placement and shaping process, a fiber band is sent out from a fire placement head channel, guided by a guiding comb to an interval between the compression roller and a mold, and finally compressed on the surface of the mold through the compressionroller. When the mold is low in intensity and cannot bear large compression force, the hollow type large deformation flexible compression roller provides a good deformation space, and the compressionforce is easy to control; and when the mold is large in curvature, the large deformation compression roller can fit the surface of the mold well under the circumstance that the compression force is not increased, and fiber filaments are enabled to completely fit the mold. The large deformation flexible compression device for the automatic fiber placement can improve adaptability of the fiber prepreg placement to the mold, can perform the placement of various structures, and improves shaping quality of parts.

An inductor configured to be mounted on a printed circuit board is provided. The inductor may include a drum core including a cylindrical body and first and second flanges extending from opposite ends of the cylindrical body, a coil wound around the cylindrical body, a plurality of pins on which opposite ends of the coil are wound, wherein each of the plurality of pins has one end fixed to the second flange and another end configured to be fixed to the printed circuit board, and at least one projection which protrudes from the second flange and is configured to support the inductor to stand vertically on the printed circuit board.

The invention relates to a method for mounting a cell string on the surface of a spatial solar cell substrate in the technical field of spatial solar power supply. The method adopts a mounting mechanism consisting of a negative pressure gripping and pressurizing frock and a frock clamp to realize the gripping of the cell string; screen printing technology is adopted to coat glue on the surface of the cell string; and after the mounting is completed, the cell string is pressurized through the negative pressure gripping and pressurizing frock to realize parallel operation of glue coating and pressurization of the cell string. The method can effectively solve the problems of glue spilling, denaturalization of the cell string and mounted bubbles in the process of mounting the cell string and realize automatic mounting.

The invention discloses an unpowered unreeling machine, a cell top surface protecting film tearing device, a film adhering device and a film adhering method. The unpowered unreeling machine comprisesan unreeling shaft for placing a reeled material; the unreeling shaft is rotatably arranged on a support frame through a bearing; the unreeling shaft is connected with a limiter which limits rotationof the unreeling shaft; when the tensile force applied to the reeled material is smaller than the torque limited value of the limiter, the unreeling shaft does not rotate; and when the tensile force applied to the reeled material is greater than torque limitation of the limiter, the unreeling shaft rotates. According to the unpowered unreeling machine, the degree of freedom of rotation of the unreeling shaft is limited by the limiter, therefore, the problem that follow-up processing is affected by unreeling of the reeled material due to the rotation inertia of the unreeling shaft or the tensile force when the unreeling shaft does not work can be avoided, and thus, a foundation is laid for development and utilization of the cell top surface film adhering equipment; and moreover, an unreeling mode is optimized into magnetic powder brake unreeling from traditional motor unreeling, the unreeling structure is simple, and electrical control of unreeling is greatly simplified.

The invention discloses a processing method of a manual chip mounter. The processing method mainly comprises the following processing steps: preparing and fixing a material, taking the material and adjusting the position, pasting and re-taking the material, and disassembling a product. Machining equipment used in the machining process of the manual chip mounter comprises a machining table, a positioning and clamping mechanism and a displacement device, wherein the positioning and clamping mechanism comprises two sets of symmetrically-arranged clamping devices, and each clamping device comprises a fixing frame fixed to the upper end of the machining table. The method has the advantages that the method is simple; the baffle plays a good role in shielding the surface-mounted components whichdo not need to be taken and used. According to the surface mount device, the influence of dust on the surface mount device is effectively avoided, so that the surface mount quality is improved; the adjustment of different pneumatic suction pen positions can be realized only by rotating the rotating plate; the different surface mount devices do not need to be frequently disassembled, assembled andreplaced by arranging the plurality of pneumatic suction pens; the operation time is saved; and the processing efficiency is improved.

The invention provides a surface mount structure used for fixedly mounting an electronic element with a pin and a welding chassis onto a circuit board. The surface mount structure comprises a pad formed on the circuit board, wherein the pad comprises a first pad welded with the bottom surface of the pin, a second pad welded with the bottom surface of the welding chassis and a connecting wire for connecting the first pad and the second pad. The structure is characterized in that the area of the surface of the second pad, which is opposite to the bottom surface of the welding chassis, is larger than the area of the surface of the first pad, which is opposite to the bottom surface of the pin; the space between the first pad and the second pad is smaller than 0.3mm; the connecting wire comprises a current-limiting part and a non-current-limiting part; the current-limiting part is connected with the first pad, and the non-current-limiting part is connected with the second pad; and the partial or overall wire width of the current-limiting part is smaller than the wire width of the non-current-limiting part.

The invention discloses an attached resistance strain sensor assembly includes a sensor body, wherein substrates are respectively mounted at two ends of a lower end face of the sensor body, a heat insulation layer is provided between two of the substrates, the heat insulation layer covers the lower end face of the sensor body, an outer cover is covered above the sensor body, two ends of the outer cover are respectively mounted on the two substrates, and a wiring terminal is provided at one side of the outer cover. The sensor assembly can be mounted to a structural member by electric welding, so that the influence of high temperature on the performance of an elastic part in the sensor body during welding is reduced, the output value of the sensor is still in an expected range, and a more accurate load measurement value can be obtained.

The invention discloses a silicone multi-function earphone cable, an earphone storage box and a mobile phone bracket, including a storage box A, a baffle, a silicone frame body, a storage box B and a supporting mechanism. The two ends of the silicone frame body are symmetrically installed with storage boxes A and The storage box B, the storage box A includes a flip cover, a box body and a wire roller, the flip cover and the box body are connected by hinges, and a wire roller is arranged at the middle position in the placement groove of the box body, and the wire roller There is an earphone groove in the placement groove on one side of the roller, and a plug sleeve is installed on the other side of the wire roller. Baffles are symmetrically arranged on both sides of the silicone frame body, and a middle position behind the silicone frame body is provided with A supporting mechanism, the supporting structure includes a mounting plate, a support plate and a positioning plate, the mounting plate is mounted on a rotating shaft, and one end of the mounting plate is rotationally connected to one end of the supporting plate through a rotating shaft. The invention has the advantages of novel structure, convenient use and rich functions.

In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.