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Electronic element and method for assembling electronic element and circuit board

A technology of electronic components and assembly methods, applied in the direction of electrical components, circuits, circuit/current collector components, etc., can solve problems such as poor welding, short circuit, solder paste contact, etc., to avoid poor welding and short circuit effect.

Active Publication Date: 2011-05-18
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the common crossover assembly method has a serious defect, that is, when the circuit board is inserted, the terminals on the electronic components will push the solder paste on the circuit board, so that the solder paste will be scraped off resulting in poor soldering , or adjacent to the solder paste contact causing a short circuit

Method used

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  • Electronic element and method for assembling electronic element and circuit board
  • Electronic element and method for assembling electronic element and circuit board
  • Electronic element and method for assembling electronic element and circuit board

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Embodiment Construction

[0026] In order to facilitate a better understanding of the purpose, structure, features, and effects of the present invention, the electronic components and their assembly method with a circuit board of the present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0027] Such as figure 1 , figure 2 and image 3 , the electronic component is an electrical connector for connecting an external electronic component (not shown) to a circuit board 40, which includes an insulating body 10, a plurality of terminals 20 fixed to the insulator 10, and The pressing part 30 is movably connected to the insulating body 10 . Of course, the electronic components can also be of other types, such as LED (Light Emitting Diode), bluetooth transmitter and so on.

[0028] The pressing part 30 is not necessarily movably connected to the insulating body 10, but may also be movably connected to the terminal 20, or the insulating body 10 a...

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Abstract

The invention relates to an electronic element for being welded on upper and lower surfaces of a circuit board by solder paste on the circuit board, which comprises a main body and a pressing piece, wherein the main body comprises an insulating body and a plurality of terminals fixed to the insulating body; each terminal is provided with a welding part; a plurality of welding parts are arranged in two rows and are to be welded on the upper and lower surfaces of the circuit board, and the distance between the two rows of welding parts is more than or equal to that of the outermost side of the solder paste on the upper and lower surfaces of the circuit board; the pressing piece is positioned on outer side of one of the two rows of welding parts, is movably connected to the main body, and is fixed to the main body finally; and the pressing piece presses against the corresponding terminals in the process from a movable state to a final fixing state, so that the distance among the two rows of welding parts is less than that of the outermost side of the solder paste on the upper and lower surfaces of the circuit board. The invention also provides a method for assembling the electronic element and the circuit board.

Description

【Technical field】 [0001] The invention relates to an electronic component and an assembly method thereof with a circuit board, in particular to an electronic component welded to the upper and lower surfaces of the circuit board through solder paste on the circuit board and an assembly method thereof with the circuit board. 【Background technique】 [0002] At present, electronic products generally include a circuit board, and a plurality of electronic components, such as electrical connectors, chips, etc., are mounted on the circuit board. The electronic components are generally soldered on one surface of the circuit board. However, with the increasing thinning of electronic products, the height of these electronic components has become a bottleneck restricting the thinning. Therefore, some of the electronic components are arranged on the edge of the circuit board and two rows of terminals are respectively straddled and welded on the The assembly method of the upper and lower...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/57H01R43/02
CPCH01R12/721H01R12/88H01R4/027H01R43/0256
Inventor 周志中
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU