Electromagnetic bandgap structure and printed circuit board comprising the same
A technology of electromagnetic bandgap structure and printed circuit board, which is applied in the direction of printed circuit, printed circuit, printed circuit components, etc., and can solve problems such as design restrictions and design difficulties
Inactive Publication Date: 2011-05-18
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
In this case, a relatively large area is required to form an elongated wire pattern, which leads to design limitations
[0009] In particular, when a large number of active and passive components have to be arranged on a small area like the main substrate or package substrate of a mobile phone where digital circuits and analog circuits are intricately arranged, the difficulty in design is more
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[0038] The objects, features and advantages of the present invention will be more clearly understood from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. Throughout the drawings, the same reference numerals are used to designate the same or similar components, and repeated descriptions thereof are omitted. Also, in the description of the present invention, when it is determined that a detailed description of related art will obscure the gist of the present invention, its description will be omitted.
[0039] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0040] figure 1 is a perspective view showing an electromagnetic bandgap structure 100 according to an embodiment of the present invention, figure 2 is shown along figure 1 The cross-sectional view of the electromagnetic bandgap structure 100 taken by the line A-A' in, and im...
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The invention discloses an electromagnetic bandgap structure and a printed circuit board comprising the same. The electromagnetic bandgap structure includes: a dielectric layer; a plurality of conductive plates formed on one side of the dielectric layer; a stitching via serving to electrically connect two adjacent conductive plates of the plurality of conductive plates; and a first dummy via formed each of the plurality of conductive plates in a direction of thickness of the dielectric layer, and a printed circuit board comprising the electromagnetic bandgap structure. The printed circuit board comprising the electromagnetic bandgap structure can solve a mixed signal problem even when an analog circuit and a digital circuit are simultaneously mounted therein.
Description
[0001] Cross References to Related Applications [0002] This application claims the priority of Korean Patent Application 10-2009-0111645, filed on November 18, 2009, entitled "Electromagneticbandgap structure and Printed circuit board having the same", the entire content of which is hereby incorporated by reference incorporated into this application. technical field [0003] The invention relates to an electromagnetic bandgap structure and a printed circuit board comprising the electromagnetic bandgap structure. Background technique [0004] Electronic devices and communication devices sold in the market are becoming smaller and thinner. Such electronic devices and communication devices are equipped with various electronic circuits (analog circuits or digital circuits) for realizing their functions and operations. Typically, such electronic circuits are mounted in printed circuit boards to perform their functions. In this situation, the operating frequencies of most of ...
Claims
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IPC IPC(8): H05K1/02H05K1/11H01L23/498H01P3/08
CPCH05K2201/09309H01P1/2005H05K2201/09781H05K2201/09627H05K1/0236H05K1/02
Inventor 睦智秀杨德桭
Owner SAMSUNG ELECTRO MECHANICS CO LTD