Bonding device

Abstract

A bonding device comprises an ultrasonic horn (12) which longitudinally oscillates in the direction of the central axis (15) by resonating to the oscillation of an ultrasonic oscillator (13), a capillary (17) fixed to the antinode of oscillation of the ultrasonic horn (12), a flange (14) provided at the node of oscillation of the ultrasonic horn (12), a bonding arm (21), a load sensor (31) fixed between the rotation center (43) of the bonding arm (21) and the flange fixing surface (22), and an oscillation load detecting section (50) for detecting the oscillation load, which is in the direction of the central axis (15) of the ultrasonic horn (12) and applied to the distal end (17a) of the capillary (17) by extracting a signal in a frequency band near the oscillation frequency of the ultrasonic oscillator from a signal acquired by the load sensor (31) through a band-pass filter. With such an arrangement, the oscillation load applied to the tip of the bonding tool is detected by a simplearrangement in the bonding device.

Description

technical field [0001] The invention relates to the structure of a welding device. Background technique [0002] In the manufacturing process of a semiconductor device, a wire bonding apparatus for connecting a pad as an electrode of a semiconductor chip and a lead as an electrode of a lead frame with a wire of a thin metal wire is often used. Most of the wire welding devices are equipped with a welding arm driven by a drive motor, an ultrasonic mold (horn) installed on the welding arm, a capillary installed on the front end of the ultrasonic mold, and an ultrasonic vibrator installed on the ultrasonic mold to drive the welding arm to rotate, so that the capillary Relative to the welding point or the pin moves along the direction of connection and separation, the initial ball formed at the front end of the capillary is pressure-welded to the welding point, and the lead wire is pressure-welded to the pin. At the same time, the ultrasonic vibrator makes the ultrasonic mold res...

AI Technical Summary

Problems solved by technology

However, in the conventional techniques described in Patent Documents 1 and 2, although changes in the ultrasonic output of the ultrasonic mold itself can be detected, changes in the vibration of the tip of the capillary, which is very small compared to the vibration of the entire ultrasonic mold, cannot be detected.

[0010] In addition, both of the conventional technologies described in Patent Documents 1 and 2 install the load sensor on the position where the ultrasonic vibration amplitude is generated in the ultrasonic mold. The problem that the sensor affects the welding performance

In addition, the sensor needs to be replaced when the ultrasonic mold is replaced. Whenever the ultrasonic mold is replaced, calibration needs to be adjusted, etc., and there is a problem of time-consuming maintenance.

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