Method for repairing DAD-40 conductive adhesive bonding product

Abstract

The invention relates to a method for repairing a DAD-40 conductive adhesive bonding product, which solves the problem that the DAD-40 conductive adhesive bonding product is difficult to repair by the steps of integral preheating, local heating repair, cooling, cleaning and the like. The invention specifically analyzes the base material and structure of the product by combining part of theoretical references, determines all the technological parameters when repairing the DAD-40 adhesive curing microwave product, is very suitable for small-lot repair of multiple types of DAD-40 adhesive curingproducts, thoroughly solves the mass production bottleneck problem when the repair is caused by the failure of printed boards and parts, is widely used in repair production of multiple types of like products, and lays foundation for the mass production of serial microwave products. The analysis on the statistical result indicates that in nearly 500 microwave products using DAD-40 adhesive curing in different batches, which have been put into production at present, the repair qualification rate of defective products is higher than 98%. The invention effectively solves the problem that the delivery schedule can not be ensured due to rejection of a great deal of products because component boards, devices and parts fail and need repairing.

Description

technical field [0001] The invention relates to a repair method for bonding products using DAD-40 conductive adhesive, and belongs to the technical field of bonding microwave products using DAD-40 conductive adhesive. Background technique [0002] With the rapid increase in batch production of microwave products, DAD-40 conductive adhesive (easy to operate, room temperature curing, good bonding strength, good conductive properties, etc.) is more and more widely used in radio frequency products. However, when the products bonded with this adhesive need to be repaired due to problems in the production process, there are problems that they cannot be disassembled or are difficult to disassemble, resulting in a large number of scrapped products when they are repaired. [0003] According to the physical and chemical properties of the DAD-40 conductive colloid itself and the structural characteristics of the bonding parts of the product, the existing process methods cannot guarante...

AI Technical Summary

Problems solved by technology

However, when the products bonded with this adhesive need to be repaired due to problems in the production process, there are problems that they cannot be disassembled or are difficult to disassemble, resulting in a large number of scrapped products when they are repaired.

[0003] According to the physical and chemical properties of the DAD-40 conductive colloid itself and the structural characteristics of the bonding parts of the product, the existing process methods cannot guarantee the integrity of the repaired product after bonding and the stability of the product quality after repairing. There is no executable process specification for rework of solid products

Therefore, in the actual production of conductive adhesive bonding products, there are common faults that cannot be repaired or product quality cannot be guaranteed when repaired. The qualified rate of products using the existing repair process is about 10%.

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