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Method for repairing DAD-40 conductive adhesive bonding product

A technology of DAD-40 and conductive adhesive, which is applied in the direction of conductive adhesive, electrical component assembly and printed circuit, etc., can solve the problems that cannot be disassembled, cannot guarantee product quality, scrapped, etc., so as to reduce production cost and ensure delivery progress , the effect of huge economic benefits

Active Publication Date: 2011-07-20
BEIJING RES INST OF TELEMETRY +1
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Problems solved by technology

However, when the products bonded with this adhesive need to be repaired due to problems in the production process, there are problems that they cannot be disassembled or are difficult to disassemble, resulting in a large number of scrapped products when they are repaired.
[0003] According to the physical and chemical properties of the DAD-40 conductive colloid itself and the structural characteristics of the bonding parts of the product, the existing process me

Method used

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  • Method for repairing DAD-40 conductive adhesive bonding product
  • Method for repairing DAD-40 conductive adhesive bonding product

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Embodiment Construction

[0017] In order to ensure the smooth progress of the batch production of microwave products, improve the qualified rate of repair of DAD-40 conductive adhesive products, and combine the inherent characteristics of various product structures, it has become a production task to repair the common faults of conductive adhesive products. One of the bottlenecks to be completed on schedule is to conduct a technological exploration test to determine a safe and economical process that ensures that the repaired product will not be damaged for reference to similar products.

[0018] 1. Analysis

[0019] The parts where the product uses conductive adhesive are mainly the conductive bonding between the shell and the metal parts and the metal layer of the printed circuit board, as well as the point-solid bonding of the product debugging and adjustment parts. In view of the actual problem of a large number of scrapped products in the rework of conductive adhesive bonding products, combined w...

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Abstract

The invention relates to a method for repairing a DAD-40 conductive adhesive bonding product, which solves the problem that the DAD-40 conductive adhesive bonding product is difficult to repair by the steps of integral preheating, local heating repair, cooling, cleaning and the like. The invention specifically analyzes the base material and structure of the product by combining part of theoretical references, determines all the technological parameters when repairing the DAD-40 adhesive curing microwave product, is very suitable for small-lot repair of multiple types of DAD-40 adhesive curing products, thoroughly solves the mass production bottleneck problem when the repair is caused by the failure of printed boards and parts, is widely used in repair production of multiple types of like products, and lays foundation for the mass production of serial microwave products. The analysis on the statistical result indicates that in nearly 500 microwave products using DAD-40 adhesive curing in different batches, which have been put into production at present, the repair qualification rate of defective products is higher than 98%. The invention effectively solves the problem that the delivery schedule can not be ensured due to rejection of a great deal of products because component boards, devices and parts fail and need repairing.

Description

technical field [0001] The invention relates to a repair method for bonding products using DAD-40 conductive adhesive, and belongs to the technical field of bonding microwave products using DAD-40 conductive adhesive. Background technique [0002] With the rapid increase in batch production of microwave products, DAD-40 conductive adhesive (easy to operate, room temperature curing, good bonding strength, good conductive properties, etc.) is more and more widely used in radio frequency products. However, when the products bonded with this adhesive need to be repaired due to problems in the production process, there are problems that they cannot be disassembled or are difficult to disassemble, resulting in a large number of scrapped products when they are repaired. [0003] According to the physical and chemical properties of the DAD-40 conductive colloid itself and the structural characteristics of the bonding parts of the product, the existing process methods cannot guarante...

Claims

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Application Information

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IPC IPC(8): C09J9/02H05K3/30
Inventor 张学文熊英朱梅
Owner BEIJING RES INST OF TELEMETRY
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