Circuit substrate
A circuit substrate and straight line technology, applied in the direction of circuits, printed circuits, printed circuit components, etc., can solve the problems affecting the wiring space of signal lines, unable to meet high-density, high-speed signal wiring, etc., and achieve the goal of maintaining signal integrity Effect
Inactive Publication Date: 2011-09-21
SUNPLUS TECH CO LTD
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Problems solved by technology
However, the size of the reference plane will affect the wiring space of the signal lines, especially the two-layer circuit substrate. In order to maintain a complete ground plane, the signal line can only be arranged on one side, so the existing two-layer circuit substrate design cannot meet high Density, high-speed signal routing requirements
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[0068] figure 1 It is a schematic cross-sectional view of the circuit structure of the circuit substrate according to the first embodiment of the present invention. figure 2 It is a schematic diagram of the wiring pattern of the circuit substrate according to the first embodiment of the present invention. The following embodiments all take the wiring of the circuit substrate per unit area as an example, where each unit area is defined as the smallest unit that can repeat the arrangement of the pads.
[0069] Please refer to figure 1 , the circuit substrate 100 includes a first pair of ground wires G-1, a second pair of ground wires G-2, multiple first connecting wires C-1 (for example, two), multiple second connecting wires C-2 ( For example two) and a plurality of conductive pillars P. The first pair of ground wires G- 1 is located on a first surface 102 of the circuit substrate 100 . The second pair of ground wires G- 2 is located on a second surface 104 of the circuit ...
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The invention provides a circuit substrate, comprising a first pair of earth wires, a second pair of earth wires, a plurality of first connecting wires, a plurality of second connecting wires and a plurality of conducting cylinders, wherein the first pair of earth wires is arranged on a first surface of the circuit substrate; the second pair of earth wires is arranged on a second surface of the circuit substrate; the plurality of conducting cylinders are arranged in the circuit substrate and vertically conducted between the first pair of earth wires and the plurality of second connecting wires as well as between the second pair of earth wires and the plurality of first connecting wires; and a first pair of signal wires is arranged among the plurality of first connecting wires, a second pair of signal wires is arranged among the plurality of second connecting wires which are earthed, thus obtaining good signal integrity.
Description
technical field [0001] The invention relates to a circuit substrate, and particularly designs a circuit substrate with a three-dimensional grounding loop. Background technique [0002] In order to maintain signal integrity and power integrity, circuit substrates traditionally used to transmit high-speed signals maintain a complete reference plane, so that when electronic signals are transmitted between signal lines, the characteristic impedance of the signal lines can be maintained. No change, especially in high-speed and high-frequency signal transmission, a good impedance matching design is required between the main control terminal and the component terminal to reduce the insertion loss caused by impedance mismatch And return loss (return loss), so as not to affect the quality of signal transmission. [0003] Generally speaking, the reference plane of the high-speed signal can be a power plane or a ground plane. A plurality of signal lines are arranged on one side of th...
Claims
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IPC IPC(8): H05K1/00H05K1/02H01L23/48
Inventor 叶丁豪
Owner SUNPLUS TECH CO LTD