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Hybrid maglev gravity compensation apparatus

A gravity compensation and maglev technology, applied in the field of gravity compensation devices, can solve the problems of affecting the thermal performance of the wafer stage, airflow disturbance, and large motor heating.

Active Publication Date: 2013-03-06
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former's air-floating structure is difficult to design and manufacture and may cause certain airflow disturbances, while the latter's motor will generate too much heat and will inevitably affect the thermal performance of the wafer holder

Method used

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  • Hybrid maglev gravity compensation apparatus
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Embodiment Construction

[0024] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0025] like figure 1 As shown, the connecting part 102 is placed below the micro-moving stage part 101, and the connecting part 102 and the top part 103 below it together form a horizontal (X / Y direction) decoupling part; the intermediate moving part 104 and the external fixing part 105 form The vertical guide part; the middle moving part 104 and the bottom fixed part 106 constitute the static vertical gravity compensation part. The decoupling part and the guide part together form the moving part, and the outer fixing part 105 and the bottom fixing part 106 are the static part. When it is necessary to measure the vertical displacement of the gravity compensation device, a differential sensor can be used - the stator part 108 of the sensor is installed on the bottom fixing part 106 or the outer fixing part 105, and the mover pa...

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Abstract

The invention discloses a hybrid maglev gravity compensation apparatus comprising a static gravity compensation module. The static gravity compensation module comprises: an intermediate moving component, an exterior fixed component arranged around the intermediate moving component, and a bottom fixed component arranged below the intermediate moving component. The intermediate moving component is in a radially suspended state with the magnetic forces between the exterior fixed component and the intermediate moving component, such that a vertical guiding to the intermediate moving component is carried out. Static gravity compensating between the exterior fixed component and the intermediate moving component can be carried out with adjustable magnetic forces. According to the invention, non-contact displacement between relatively moving objects can be achieved with maglev forces. Meanwhile, gravity compensation, horizontal and vertical decoupling of a wafer supporting stage can be achieved.

Description

technical field [0001] The invention relates to a hybrid maglev gravity compensation device. Background technique [0002] With the continuous improvement of the integration of large-scale integrated circuit devices and the continuous enhancement of lithography resolution, the requirements for the feature line width indicators of lithography machines are also constantly improving. At present, the lithography machine has developed into a combination of the inner world and the outer world, in which the three independent worlds of the workpiece table, the mask table and the lighting system are respectively vibration-damped and vibration-isolated. [0003] Taking the micro-movement module as an example, it is very important to protect the wafer stage from the vibration of the workpiece stage system and the base frame during the exposure process. It is necessary to adopt an effective solution to reduce and isolate the wafer stage. The gravity compensator structure is a new type ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 方洁吴立伟齐宁宁齐芊枫
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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