Wafer conveying device with fragment detection

Abstract

A wafer conveying device with fragment detection is used for detecting wafers output by a wafer supporting device, and comprises a drawing device for conveying the wafers, at least one set of wafer conveying device for conveying the wafers, a plurality of fragment detectors and a set of wafer transferring device, wherein the fragment detectors are arranged below both sides of a conveying belt fordetecting the wafers conveyed on the conveying belt and judging whether the wafers are broken; then, the wafers on the wafer conveying device after detection are drawn through the wafer drawing device of the wafer transferring device; and the wafers are transferred and distributed on a plurality of sets of output orbits of the wafer transferring device by means of transverse or longitudinal movement.

Description

technical field [0001] The present invention relates to a wafer conveying equipment with fragment detection, especially a wafer conveying equipment used between wafer carrying devices, and the wafer conveying equipment is more capable of performing fragment detection and fragment detection on the wafers it carries. exclude. Background technique [0002] At present, the main materials of solar cells are mainly silicon and elements or compounds such as gallium arsenide (GaAs), cadmium telluride (CdTe), germanium, etc., in order to improve the conversion efficiency of solar energy into electrical energy or thermal energy. Different elements or compounds are used based on different application considerations. For example, consumer products for people’s livelihood usually use amorphous silicon solar panels; gallium arsenide solar cells are used in space; if they are used in deserts, oceans, etc. to generate electricity Purpose and other large power sources use polycrystalline si...

AI Technical Summary

Problems solved by technology

[0005] Since the wafer transfer methods of the two wafer carrying devices are very different, they belong to two different carrying devices, so in the actual process of setting up a factory, users often choose what they need and combine them by themselves, while the same The movement and transformation between one or two types of wafer carrying devices also occurs frequently, but during the transportation of the wafer, it is easy to produce slight structural defects due to collisions, and the problems cannot be easily found even by visual inspection. However, when all manufacturing processes are completed, the actual circuit will be affected by damage to varying degrees due to cracks on the wafer surface;

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