Piezoelectric drive jet-type dotting device

Abstract

The invention provides a piezoelectric drive jet-type dotting device. The dotting device comprises a main body supporting frame for providing an installation base, a driving mechanism for providing linear reciprocating impacts and a liquid supply mechanism for providing marking liquid, wherein the driving mechanism and the liquid supply mechanism are fixedly arranged on the main body supporting frame; the driving mechanism comprises a piezoelectric ceramic block and an impact pin which is driven by the piezoelectric ceramic block; the liquid supply mechanism comprises a nozzle; and the impactpin is used for impacting the nozzle intermittently. The invention has the advantages that: (1) due to the adoption of a non-contact injection technology, the dotting device does not do motion in thedirection vertical to the surface of a wafer, so that ink-jet dotting efficiency is improved, and a motion control system is simplified; (2) different from the operating mode that the conventional contact type dotting device is required to dip ink for dotting every time, a storage type material supplying mode is used for the dotting device, and the dotting device can dot continuously within a period of time, so that dotting efficiency is greatly improved; and (3) the dotting device has a compact design structure, and is easy to assemble and control.

Description

technical field [0001] The invention belongs to the technical field of microfluid jet printing, and in particular relates to a piezo-driven inker capable of jetting ink dots with good uniformity at high speed and stably for wafer detection and sorting processes. Background technique [0002] In wafer manufacturing and testing, since each chip containing a complete IC circuit on the wafer has to be electrically tested and then cut from the original chip, in order to ensure accurate sorting of the chip after cutting, all chips are certified as "failure". All wafers need to be marked with tiny ink dots on the surface to distinguish them from qualified wafers. Statistics show that the average chip yield of each wafer in mass production is about 70%, while in test production, the yield can be as low as 30%. It can be seen that the ink dot marking plays an extremely important role in the high-speed detection and sorting of wafers. key takeover role. The high strength and precisi...

AI Technical Summary

Problems solved by technology

In the detection and sorting process of ultra-thin wafers, when the wafer is subjected to the external force and vibration of the indenter contacting the wafer surface, it may cause cracks or even damage. If the local pressure (often at the crack position where the stress is concentrated ) exceeds the ultimate strength of silicon and is susceptible to immediate fracturing damage

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