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display device

一种显示装置、透明基板的技术，应用在辨认装置、离子注入镀覆、涂层等方向，能够解决密接性下降、氮化铜不是、配线膜劣化等问题，达到形状优良、构图容易、低电阻率的效果

Inactive Publication Date: 2011-11-30
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper nitride itself is not a stable compound
Therefore, in this technology, in the high-temperature annealing process during the manufacture of displays (such as liquid crystal panels), N atoms may be 2 When gas is released, the wiring film is deteriorated, and the adhesion is reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] (production of samples)

[0097] In this example, the type and content of the Cu alloy constituting the first layer (Y) and the thickness of the first layer (Y) were investigated for the samples (No. 3 to 35) in Table 1 prepared as follows Effects on resistivity and adhesion to glass substrates.

[0098] A Cu alloy containing various elements shown in Table 1 was fabricated as the first layer (Y) by the sputtering method as follows, and a Cu alloy film composed of a laminated structure of pure Cu was fabricated as the second layer (X) . In Table 1, No. 3 to 16 are examples of adding Mn as an element constituting the first layer (Y), No. 17 is an example of adding Bi, No. 18 to 21 are examples of adding Ni, and No. 21 to No. 23 is an example of adding Zn, No. 24-25 is an example of adding Al, No. 26-27 is an example of adding Ti, No. 28-29 is an example of adding Mg, No. 30-31 is an example of adding Ca , Nos. 32-33 are examples in which Nb is added, and No. 34-35 are...

Embodiment 2

[0131] In this example, the adhesiveness after the DC stress test and the peeling test when using the soda-lime glass substrate was examined about the samples (this invention example and comparative example) produced as follows. The DC stress test is to maintain a certain distance and apply a certain driving voltage (direct current, DC), that is, stress, between the electrically separated patterns to maintain a certain electric field strength between the patterns, and to check the change of the leakage current between the electrodes. , peeling or formation of foreign matter and other appearance inspection methods. By applying a voltage higher than the normal applied voltage in a constant temperature and humidity atmosphere (temperature 80°C, humidity 80%), it is possible to inspect the wiring generated by the movement of charges caused by normal panel operation in a short time The exception checking method is useful. Here, two comb-shaped electrode patterns formed with a line...

Embodiment 3

[0145] In this example, the constituent element of the first layer (Y) is Mn, and the effects of the content of Mn and the film thickness of the first layer (Y) on the adhesion to the glass substrate and the resistivity were further studied in detail.

[0146] (1) Evaluation of Adhesion with Glass Substrate

[0147] Except for the case where the glass substrate is EAGLE2000 (diameter: 4 inches x thickness: 0.7 mm) manufactured by Corning, and the film thickness of the first layer (Y) varies between 5 and 100 nm and the second layer (X) A laminated film of the first layer (Y) and the second layer (X) was formed on a glass substrate in the same manner as in Example 1 except that the film thickness was constant at 500 nm. After film formation, heat treatment was performed at 320° C. for 5 minutes under a nitrogen atmosphere of 1 Pa using a CVD apparatus. Next, use a cutter to form 5×5 grid-shaped incisions at 1 mm intervals on the film-forming surface, and firmly stick 8422B tap...

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Abstract

A display device is provided with a Cu alloy film having high adhesiveness to a transparent substrate and a low electrical resistivity. The Cu alloy film for the display device is directly brought into contact with the transparent substrate, and the Cu alloy film has the multilayer structure, which includes a first layer (Y) composed of a Cu alloy containing, in total, 2-20 atm% of at least one element selected from among a group composed of Zn, Ni, Ti, Al, Mg, Ca, W, Nb and Mn, and a second layer (X) which is composed of pure Cu or substantially a Cu alloy having Cu as the main component and has an electrical resistivity lower than that of the first layer (Y). The first layer (Y) is brought into contact with the transparent substrate.

Description

technical field [0001] The present invention relates to a display device including a Cu alloy film used in a display device such as a liquid crystal display or an organic EL display, and more specifically, to a display device including a Cu alloy film excellent in adhesion to a transparent substrate such as a glass substrate. Background technique [0002] So far, aluminum (Al) alloy films have been used for wiring of display devices typified by liquid crystal displays. However, as the size of the display device increases and the image quality increases, the problems of signal delay and power loss due to large wiring resistance become more and more obvious. Therefore, copper (Cu), which has a lower resistance than Al, has attracted attention as a wiring material. The resistivity of Al is 2.5×10 -6 Ω cm, compared to this, the resistivity of Cu is as low as 1.6×10 -6 Ω·cm. [0003] However, Cu has low adhesiveness to the glass substrate and has a problem of being easily pee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30C22C9/00C22C9/04C22C9/05C22C9/06C23C14/14G02F1/1343H01L21/28H01L21/3205H01L23/52H01L29/786
CPCH01L29/4908B32B15/01G02F1/136286H01L29/458C23C14/14H01L23/53233C23C14/025C22C9/00G02F1/1368G02F2001/136295G02F2001/13629H01L23/53238H01L27/1214G02F1/13629G02F1/136295H01L27/124H01L2924/0002H01L2924/00
Inventor 后藤裕史三木绫富久胜文越智元隆大西隆钉宫敏洋
Owner KOBE STEEL LTD
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