Device and method for solidifying ink on flexible circuit board
A flexible circuit board and curing method technology, which is applied to the general parts of printing machinery, printing, printing machines, etc., can solve the problems of easy creases, low production efficiency, and reduce the quality of flexible circuit boards, so as to improve the quality , prevent the absorption of foreign matter and creases, and improve production efficiency
Active Publication Date: 2013-04-17
ZHUHAI ZIXIANG ELECTRONICS TECH
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Problems solved by technology
At present, the curing of solder resist ink is often carried out in an oven, and the curing time is about 2 hours each time. Only a single product can be processed each time, and the production efficiency is low; and when the printed flexible circuit board is an ultra-thin product (thickness is about 150μm), it is very easy to produce creases in the process of taking and finishing, thereby reducing the quality of the flexible circuit board; in addition, before the flexible circuit board is placed in the oven for ink curing, it needs to be Glass fiber paper is added between the flexible circuit boards to be cured by the ink, and the glass fiber paper is easy to adhere to foreign matter. Under the high temperature condition of the oven, the foreign matter attached to the glass fiber paper is easy to transfer and absorb on the flexible circuit board, resulting in the failure of the flexible circuit board. poor board quality
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[0024] The present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings.
[0025] Such as figure 1 and figure 2 As shown, a device for ink curing of flexible circuit boards includes: a rolling-in device 1, a drying device 2 and a rolling-out device 3; the drying device includes a conveying unit 21 and a heating unit 22, and the heating The unit is used for ink curing of the flexible circuit board, and the conveying unit is used for conveying the flexible circuit board, and the width of the conveying unit is more than twice the width of the flexible circuit board to be cured by ink; the flexible circuit board passes The roll-in device enters the conveying unit of the drying device, and solidifies the ink during the process of being conveyed by the conveying unit, and then rolls out through the unwinding device.
[0026] Wherein, the conveying unit includes a conveying belt, and the conveying belt is in the sha...
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The invention relates to a device and method for solidifying ink on a flexible circuit board. The device for solidifying ink on a flexible circuit board comprises a winding device, a drying device and an unwinding device, wherein the drying device comprises a transmission unit of which the width is more than twice that of a flexible circuit board needing ink solidification. The flexible circuit board enters the transmission unit of the drying device by virtue of the winding device, is subjected to ink solidification during the transmission process of the transmission unit and then is unwound by the unwinding device. In addition, the invention also provides a method for solidifying ink by using the device. The device for solidifying ink on a flexible circuit board can perform roll-to-roll continuous solidification of flexible circuit boards, thus the production efficiency is improved; moreover, the flexible circuit board can be prevented from absorbing foreign matters and generating creases during the ink solidification process, thus the quality of the flexible circuit board can be improved.
Description
technical field [0001] The invention relates to a device and method for ink curing of flexible circuit boards. Background technique [0002] At present, photosensitive solder resist ink is often printed on flexible circuit boards to ensure the solder resistance of flexible circuit boards and the accuracy of solder joint size! The solder resist ink printing process mainly includes the following five steps, namely ink printing, ink pre-drying, ink exposure, ink phenomenon, and ink curing. At present, the curing of solder resist ink is often carried out in an oven, and the curing time is about 2 hours each time. Only a single product can be processed each time, and the production efficiency is low; and when the printed flexible circuit board is an ultra-thin product (thickness is about 150μm), it is very easy to produce creases in the process of taking and finishing, thereby reducing the quality of the flexible circuit board; in addition, before the flexible circuit board is p...
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IPC IPC(8): B41F23/04
Inventor 牛建军胡军
Owner ZHUHAI ZIXIANG ELECTRONICS TECH