Device and method for carrying out printing ink curing on flexible circuit board
A flexible circuit board and curing method technology, which is applied in the secondary treatment of printed circuits, application of non-metallic protective layers, etc. The effect of preventing foreign matter adsorption and creases, improving quality and improving production efficiency
Active Publication Date: 2012-01-25
ZHUHAI ZIXIANG ELECTRONICS TECH
View PDF4 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
At present, the curing of solder resist ink is often carried out in an oven, and the curing time is about 2 hours each time. Only a single product can be processed each time, and the production efficiency is low; and when the printed flexible circuit board is an ultra-thin product (thickness is about 150μm), it is very easy to produce creases in the process of taking and finishing, thereby reducing the quality of the flexible circuit board; in addition, before the flexible circuit board is placed in the oven for ink curing, it needs to be Glass fiber paper is added between the flexible circuit boards to be cured by the ink, and the glass fiber paper is easy to adhere to foreign matter. Under the high temperature condition of the oven, the foreign matter attached to the glass fiber paper is easy to transfer and absorb on the flexible circuit board, resulting in the failure of the flexible circuit board. poor board quality
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] The present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings.
[0025] Such as figure 1 and figure 2 As shown, a device for curing ink on a flexible circuit board includes: a rolling-in device 1, a drying device 2 and a rolling-out device 3; the drying device includes a transfer unit 21 and a heating unit 22, and the heating unit is used For the ink curing of flexible circuit boards, the transfer unit is used to transfer flexible circuit boards; the flexible circuit boards enter the transfer unit of the drying device through the rolling device, and the ink is cured during the process of being transferred by the transfer unit , and then rolled out through the unwinding device.
[0026] Wherein, the conveying unit includes a conveying belt, and the conveying belt is in the shape of a mesh chain and made of metal material.
[0027] Wherein, the drying device also includes:
[0028] The control unit ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a device and method for carrying out printing ink curing on a flexible circuit board. The device for carrying out the printing ink curing on the flexible circuit board comprises a rolling-in device, a drying device and a rolling-out device; and the flexible circuit board enters a conveying unit of the drying device through the rolling-in device, is subjected to printing ink curing in the conveying process of the conveying unit and is then rolled out by the rolling-out device. In addition, the invention also provides a method for carrying out printing ink curing by using the device. The device for carrying out printing ink curing on the flexible circuit board can be used for continuously curing the flexible circuit board roll to roll so that the production efficiency is improved, and also can be used for preventing the flexible circuit board from adsorbing foreign matters and generating crease lines in the printing ink curing process so that the quality of the flexible circuit board is improved.
Description
technical field [0001] The invention relates to a device and a method for curing ink of a flexible circuit board. Background technique [0002] At present, photosensitive solder resist ink is often printed on flexible circuit boards to ensure the solder resistance of flexible circuit boards and the accuracy of solder joint size! The solder resist ink printing process mainly includes the following five steps, namely ink printing, ink pre-drying, ink exposure, ink phenomenon, and ink curing. At present, the curing of solder resist ink is often carried out in an oven, and the curing time is about 2 hours each time. Only a single product can be processed each time, and the production efficiency is low; and when the printed flexible circuit board is an ultra-thin product (thickness is about 150μm), it is very easy to produce creases in the process of taking and finishing, thereby reducing the quality of the flexible circuit board; in addition, before the flexible circuit board i...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
Inventor 牛建军张慧芳
Owner ZHUHAI ZIXIANG ELECTRONICS TECH